The influence of thermal treatment on the stress characteristics of suspended porous silicon membranes on silicon

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dc.contributor.author Papadimitriou, D en
dc.contributor.author Tsamis, C en
dc.contributor.author Nassiopoulou, AG en
dc.date.accessioned 2014-03-01T02:42:59Z
dc.date.available 2014-03-01T02:42:59Z
dc.date.issued 2004 en
dc.identifier.issn 0925-4005 en
dc.identifier.uri http://hdl.handle.net/123456789/31172
dc.subject Micro-hotplates en
dc.subject Porous silicon en
dc.subject Stress en
dc.subject Suspended membranes en
dc.subject.classification Chemistry, Analytical en
dc.subject.classification Electrochemistry en
dc.subject.classification Instruments & Instrumentation en
dc.subject.other Annealing en
dc.subject.other Anodic oxidation en
dc.subject.other Chemical vapor deposition en
dc.subject.other Etching en
dc.subject.other Heat treatment en
dc.subject.other Ion implantation en
dc.subject.other Membranes en
dc.subject.other Ohmic contacts en
dc.subject.other Raman spectroscopy en
dc.subject.other Stress analysis en
dc.subject.other Device fabrication en
dc.subject.other Isotropic etching en
dc.subject.other Micro-hotplates en
dc.subject.other Suspended membranes en
dc.subject.other Porous silicon en
dc.title The influence of thermal treatment on the stress characteristics of suspended porous silicon membranes on silicon en
heal.type conferenceItem en
heal.identifier.primary 10.1016/j.snb.2004.04.065 en
heal.identifier.secondary http://dx.doi.org/10.1016/j.snb.2004.04.065 en
heal.language English en
heal.publicationDate 2004 en
heal.abstract In this work, the mechanical properties of suspended porous silicon (PS) membranes on bulk silicon are investigated. Micro-Raman spectroscopy is used to characterize stresses in supported PS membranes, in the form of micro-hotplates that are fabricated by a recently developed technique, based on the isotropic etching of silicon under a PS layer, in a high-density plasma reactor. Important information is obtained for the stress evolution of PS as a function of porosity and the optimum annealing conditions in device fabrication. (C) 2004 Elsevier B.V. All rights reserved. en
heal.publisher ELSEVIER SCIENCE SA en
heal.journalName Sensors and Actuators, B: Chemical en
dc.identifier.doi 10.1016/j.snb.2004.04.065 en
dc.identifier.isi ISI:000224064100054 en
dc.identifier.volume 103 en
dc.identifier.issue 1-2 en
dc.identifier.spage 356 en
dc.identifier.epage 361 en

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