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High-precision flip-chip technology for alloptical wavelength conversion using SOI photonic circuit

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dc.contributor.author Zimmermann, L en
dc.contributor.author Preve, GB en
dc.contributor.author Voigt, K en
dc.contributor.author Winzer, G en
dc.contributor.author Kreissl, J en
dc.contributor.author Moerl, L en
dc.contributor.author Stamatiadis, C en
dc.contributor.author Stampoulidis, L en
dc.contributor.author Avramopoulos, H en
dc.date.accessioned 2014-03-01T02:47:22Z
dc.date.available 2014-03-01T02:47:22Z
dc.date.issued 2011 en
dc.identifier.issn 19492081 en
dc.identifier.uri http://hdl.handle.net/123456789/33105
dc.subject High Speed en
dc.subject Optical Fiber en
dc.subject Optical Filters en
dc.subject Optical Interferometry en
dc.subject Semiconductor Optical Amplifier en
dc.subject Wavelength Conversion en
dc.subject Flip Chip en
dc.subject.other All optical wavelength converter en
dc.subject.other All-optical en
dc.subject.other All-optical wavelength conversion en
dc.subject.other Flip chip technologies en
dc.subject.other High-precision en
dc.subject.other High-speed en
dc.subject.other Hybrid integration en
dc.subject.other Photonic circuits en
dc.subject.other Wavelength-switching en
dc.subject.other Photonics en
dc.subject.other Photonic integration technology en
dc.title High-precision flip-chip technology for alloptical wavelength conversion using SOI photonic circuit en
heal.type conferenceItem en
heal.identifier.primary 10.1109/GROUP4.2011.6053775 en
heal.identifier.secondary http://dx.doi.org/10.1109/GROUP4.2011.6053775 en
heal.identifier.secondary 6053775 en
heal.publicationDate 2011 en
heal.abstract High-precision hybrid integration on SOI photonic circuit was developed. The technology was applied to fabricate an integrated high-speed all-optical wavelength converter. Potential of the platform was demonstrated by 40Gb/s all-optical wavelength switching. © 2011 IEEE. en
heal.journalName IEEE International Conference on Group IV Photonics GFP en
dc.identifier.doi 10.1109/GROUP4.2011.6053775 en
dc.identifier.spage 237 en
dc.identifier.epage 239 en


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