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Fabrication and experimental demonstration of the first 160 Gb/s hybrid silicon-on-insulator integrated all-optical wavelength converter

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dc.contributor.author Stamatiadis, C en
dc.contributor.author Stampoulidis, L en
dc.contributor.author Kalavrouziotis, D en
dc.contributor.author Lazarou, I en
dc.contributor.author Vyrsokinos, K en
dc.contributor.author Zimmermann, L en
dc.contributor.author Voigt, K en
dc.contributor.author Preve, GB en
dc.contributor.author Moerl, L en
dc.contributor.author Kreissl, J en
dc.contributor.author Avramopoulos, H en
dc.date.accessioned 2014-03-01T02:09:00Z
dc.date.available 2014-03-01T02:09:00Z
dc.date.issued 2012 en
dc.identifier.issn 10944087 en
dc.identifier.uri https://dspace.lib.ntua.gr/xmlui/handle/123456789/29768
dc.subject.other 160 Gb/s en
dc.subject.other All optical wavelength converter en
dc.subject.other All-optical wavelength conversion en
dc.subject.other Delay interferometer en
dc.subject.other Free spectral range en
dc.subject.other Gold-tin en
dc.subject.other Integrated photonic circuit en
dc.subject.other Monolithically integrated en
dc.subject.other Multi-mode interference en
dc.subject.other On chips en
dc.subject.other Power penalty en
dc.subject.other Signal polarity en
dc.subject.other Silicon on insulator en
dc.subject.other Silicon-on-insulator substrates en
dc.subject.other SOI substrates en
dc.subject.other Thermal heaters en
dc.subject.other Ultra high speed en
dc.subject.other Monolithic integrated circuits en
dc.subject.other Tin en
dc.subject.other Optical frequency conversion en
dc.title Fabrication and experimental demonstration of the first 160 Gb/s hybrid silicon-on-insulator integrated all-optical wavelength converter en
heal.type journalArticle en
heal.identifier.primary 10.1364/OE.20.003825 en
heal.identifier.secondary http://dx.doi.org/10.1364/OE.20.003825 en
heal.publicationDate 2012 en
heal.abstract We present a hybrid integrated photonic circuit on a silicon-on-insulator substrate that performs ultra high-speed all-optical wavelength conversion. The chip incorporates a 1.25 mm non-linear SOA mounted on the SOI board using gold-tin bumps as small as 14 μm. ?he device performs chirp filtering and signal polarity inversion with two multi-mode interference (MMI) - based cascaded delay interferometers (DIs) monolithically integrated on the same SOI substrate. Full free spectral range (FSR) tuning of the DIs is accomplished by two independently tuneable on-chip thermal heaters. We demonstrate 160Gb/s all-optical wavelength conversion with power penalties of less than 4.6dB. © 2012 Optical Society of America. en
heal.journalName Optics Express en
dc.identifier.doi 10.1364/OE.20.003825 en
dc.identifier.volume 20 en
dc.identifier.issue 4 en
dc.identifier.spage 3825 en
dc.identifier.epage 3831 en


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