Internal stress in growing wo3 films

Panagopoulos, CN

dc.contributor.author	Panagopoulos, CN	en
dc.date.accessioned	2014-03-01T01:07:30Z
dc.date.available	2014-03-01T01:07:30Z
dc.date.issued	1989	en
dc.identifier.issn	0254-0584	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/10036
dc.relation.uri	http://www.scopus.com/inward/record.url?eid=2-s2.0-0024900322&partnerID=40&md5=4c09d95772dd826b9bb86f885c11d657	en
dc.subject.classification	Materials Science, Multidisciplinary	en
dc.subject.other	Oxides--Stresses	en
dc.subject.other	Stresses--Analysis	en
dc.subject.other	Internal Stress	en
dc.subject.other	Potentiostatic Anodization	en
dc.subject.other	Tungsten Oxides	en
dc.subject.other	Valve Metals	en
dc.subject.other	Tungsten and Alloys	en
dc.title	Internal stress in growing wo3 films	en
heal.type	journalArticle	en
heal.language	English	en
heal.publicationDate	1989	en
heal.abstract	During the potentiostatic anodization of tungsten,the anodic and open-circuit stress were studied. The anodic stress was observed to be compressive whereas the open-circuit stress was found to be tensile in the anodic tungsten oxide. The anodic stress was found to decrease and the open-circuit stress to increase with increasing thickness of growing tungsten oxide. © 1989.	en
heal.publisher	ELSEVIER SCIENCE SA LAUSANNE	en
heal.journalName	Materials Chemistry and Physics	en
dc.identifier.isi	ISI:A1989CC16600008	en
dc.identifier.volume	24	en
dc.identifier.issue	1-2	en
dc.identifier.spage	89	en
dc.identifier.epage	97	en