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Photoelastic study of a crack approaching the bonded half-plates interface

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dc.contributor.author Theotokoglou, EN en
dc.contributor.author Tsamasphyros, GJ en
dc.contributor.author Spyropoulos, CP en
dc.date.accessioned 2014-03-01T01:07:37Z
dc.date.available 2014-03-01T01:07:37Z
dc.date.issued 1989 en
dc.identifier.issn 0013-7944 en
dc.identifier.uri https://dspace.lib.ntua.gr/xmlui/handle/123456789/10073
dc.subject.classification Mechanics en
dc.subject.other Mathematical Techniques--Integral Equations en
dc.subject.other Photoelasticity en
dc.subject.other Stresses--Analysis en
dc.subject.other Bonded Half-Plates Interface en
dc.subject.other Cauchy Type Singularity en
dc.subject.other Cracks Photoelastic Study en
dc.subject.other Simulated Isochromatic Fringe Patterns en
dc.subject.other Stress Intensity Factors en
dc.subject.other Plates en
dc.title Photoelastic study of a crack approaching the bonded half-plates interface en
heal.type journalArticle en
heal.identifier.primary 10.1016/0013-7944(89)90240-3 en
heal.identifier.secondary http://dx.doi.org/10.1016/0013-7944(89)90240-3 en
heal.language English en
heal.publicationDate 1989 en
heal.abstract A photoelastic analysis of a crack approaching the free boundary of a half-plate or the interface of bonded plates is presented. It is based on the numerical approximation of the exact stress fields obtained by the method of singular integral equations. The stress intensity factors at the crack tips or the applied stresses at infinity are experimentally determined using photoelastic measurements. This is effected either by using the proposed numerical procedure or directly through the use of concise nomograms. Numerical results and simulated isochromatic fringe patterns are presented for a straight crack perpendicular to the interface only. © 1989. en
heal.publisher PERGAMON-ELSEVIER SCIENCE LTD en
heal.journalName Engineering Fracture Mechanics en
dc.identifier.doi 10.1016/0013-7944(89)90240-3 en
dc.identifier.isi ISI:A1989AQ60300003 en
dc.identifier.volume 34 en
dc.identifier.issue 1 en
dc.identifier.spage 31 en
dc.identifier.epage 42 en


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