Nickel plating by pulse electrolysis: textural and microstructural modifications due to adsorption/desorption phenomena

Kollia, C; Spyrellis, N; Amblard, J; Froment, M; Maurin, G

dc.contributor.author	Kollia, C	en
dc.contributor.author	Spyrellis, N	en
dc.contributor.author	Amblard, J	en
dc.contributor.author	Froment, M	en
dc.contributor.author	Maurin, G	en
dc.date.accessioned	2014-03-01T01:08:03Z
dc.date.available	2014-03-01T01:08:03Z
dc.date.issued	1990	en
dc.identifier.issn	0021-891X	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/10257
dc.subject	Microstructures	en
dc.subject	Nickel	en
dc.subject	Relaxation Time	en
dc.subject.classification	Electrochemistry	en
dc.title	Nickel plating by pulse electrolysis: textural and microstructural modifications due to adsorption/desorption phenomena	en
heal.type	journalArticle	en
heal.identifier.primary	10.1007/BF01019584	en
heal.identifier.secondary	http://dx.doi.org/10.1007/BF01019584	en
heal.language	English	en
heal.publicationDate	1990	en
heal.abstract	Nickel growth from an organic-free Watts bath working under d.c. plating conditions is governed by several interfacial inhibitors such as H2, Hads or Ni(OH)2. These inhibitors determine most of the structural or macroscopic properties of the nickel plates. Pulse electrolysis (p.e.) is thus a powerful means of perturbing the adsorption-desorption phenomena occurring at the nickel/electrolyte interface and hence offers an opportunity of preparing deposits exhibiting better properties. Through an analysis of the textural and microstructural changes produced by p.e., we show that molecular inhibitors desorb during the relaxation time, while conversely other inhibitors like Hads or anions are more strongly adsorbed and inhibit the nickel cathodic process. © 1990 Chapman and Hall Ltd.	en
heal.publisher	Kluwer Academic Publishers	en
heal.journalName	Journal of Applied Electrochemistry	en
dc.identifier.doi	10.1007/BF01019584	en
dc.identifier.isi	ISI:A1990EG18300024	en
dc.identifier.volume	20	en
dc.identifier.issue	6	en
dc.identifier.spage	1025	en
dc.identifier.epage	1032	en