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FLOW SIMULATION OF HERSCHEL-BULKLEY FLUIDS THROUGH EXTRUSION DIES

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dc.contributor.author MITSOULIS, E en
dc.contributor.author ABDALI, SS en
dc.contributor.author MARKATOS, NC en
dc.date.accessioned 2014-03-01T01:09:25Z
dc.date.available 2014-03-01T01:09:25Z
dc.date.issued 1993 en
dc.identifier.issn 0008-4034 en
dc.identifier.uri https://dspace.lib.ntua.gr/xmlui/handle/123456789/10964
dc.subject YIELD STRESS en
dc.subject HERSCHEL-BULKLEY MODEL en
dc.subject NON-NEWTONIAN FLOW en
dc.subject NONISOTHERMAL FLOW en
dc.subject EXTRUDATE SWELL en
dc.subject.classification Engineering, Chemical en
dc.subject.other NUMERICAL-SIMULATION en
dc.subject.other VISCOUS DISSIPATION en
dc.subject.other EXTRUDATE SWELL en
dc.subject.other YIELD en
dc.title FLOW SIMULATION OF HERSCHEL-BULKLEY FLUIDS THROUGH EXTRUSION DIES en
heal.type journalArticle en
heal.identifier.primary 10.1002/cjce.5450710120 en
heal.identifier.secondary http://dx.doi.org/10.1002/cjce.5450710120 en
heal.language English en
heal.publicationDate 1993 en
heal.abstract The flow of viscoplastic materials through extrusion dies has been studied numerically using the finite element method. Rheological data for viscoplastic doughs have been fitted by the Herschel-Bulkley model, which incorporates a yield stress into the power-law model. Non-isothermal simulations show the extent and shape of yielded/unyielded regions and the development of temperature field assuming different modes of heat transfer at the boundaries. The results reveal that viscous dissipation causes appreciable temperature rises in the extrudate in agreement with measured values at the extruded material surface. The extrudate swell results show a maximum for a certain range of apparent shear rates also observed experimentally. However, the inelastic simulations based on the Herschel-Bulkley model always under-predict the experimental swelling values. A heuristic approach is also used to determine the level of elasticity required to produce the experimental values. en
heal.publisher CANADIAN SOC CHEMICAL ENGINEERING en
heal.journalName CANADIAN JOURNAL OF CHEMICAL ENGINEERING en
dc.identifier.doi 10.1002/cjce.5450710120 en
dc.identifier.isi ISI:A1993KQ14300019 en
dc.identifier.volume 71 en
dc.identifier.issue 1 en
dc.identifier.spage 147 en
dc.identifier.epage 160 en


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