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Transition properties of a vertical conductor connecting two microstrip lines at different planes

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dc.contributor.author Theodorou Aristidis, S en
dc.contributor.author Uzunoglu Nikolaos, K en
dc.date.accessioned 2014-03-01T01:10:24Z
dc.date.available 2014-03-01T01:10:24Z
dc.date.issued 1994 en
dc.identifier.issn 0018-9480 en
dc.identifier.uri https://dspace.lib.ntua.gr/xmlui/handle/123456789/11390
dc.subject Boundary Condition en
dc.subject Linear System of Equations en
dc.subject Microstrip Line en
dc.subject Surface Current en
dc.subject Three Dimensional en
dc.subject Transmission Coefficient en
dc.subject Method of Moment en
dc.subject.classification Engineering, Electrical & Electronic en
dc.subject.other Dielectric properties en
dc.subject.other Electric currents en
dc.subject.other Electric properties en
dc.subject.other Electromagnetic wave reflection en
dc.subject.other Electromagnetic wave transmission en
dc.subject.other Green's function en
dc.subject.other Monolithic microwave integrated circuits en
dc.subject.other Dynamic solution techniques en
dc.subject.other Method of moments techniques en
dc.subject.other Multilayer shielded microstrip geometry en
dc.subject.other Transition properties en
dc.subject.other Vertical conductors en
dc.subject.other Microstrip lines en
dc.title Transition properties of a vertical conductor connecting two microstrip lines at different planes en
heal.type journalArticle en
heal.identifier.primary 10.1109/22.339753 en
heal.identifier.secondary http://dx.doi.org/10.1109/22.339753 en
heal.language English en
heal.publicationDate 1994 en
heal.abstract Transition properties of a vertical conductor connecting two semi-infinite microstrip lines at different planes are analyzed by using dynamic solution techniques. This fundamental geometry is encountered in many microwave interconnect and packaging applications, and in particular when three-dimensional multilayer metallization techniques are employed. In order to compute the reflection and transmission properties of this three-dimensional discontinuity, a method of moments technique is employed. To this end, the Green's function of the multilayer shielded microstrip geometry is used. The surface current density distributions on the two semi-infinite microstrip lines are described in terms of the incident, reflected, and transmitted guided fundamental mode wave distributions plus a summation of current pulses in the region of discontinuity. The current on the vertical cylindrical connection line is also described in terms of a superposition of triangular shaped pulses. Application of the boundary conditions on the three conductors leads to a simultaneous linear system of equations by using a method of moments technique. Reflection and transmission coefficients are computed for several connection lines, and numerical results are presented. It is shown that a rather small connection conductor height can induce large reflection phenomena for an incident wave. en
heal.publisher IEEE, Piscataway, NJ, United States en
heal.journalName IEEE Transactions on Microwave Theory and Techniques en
dc.identifier.doi 10.1109/22.339753 en
dc.identifier.isi ISI:A1994QA30400013 en
dc.identifier.volume 42 en
dc.identifier.issue 12 pt 1 en
dc.identifier.spage 2277 en
dc.identifier.epage 2284 en


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