Preparation and study of aramid/epoxy prepregs

Andreopoulos, AG; Tarantili, P

dc.contributor.author	Andreopoulos, AG	en
dc.contributor.author	Tarantili, P	en
dc.date.accessioned	2014-03-01T01:11:25Z
dc.date.available	2014-03-01T01:11:25Z
dc.date.issued	1995	en
dc.identifier.issn	0022-2461	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/11634
dc.subject	Epoxy Resin	en
dc.subject	Tensile Strength	en
dc.subject.classification	Materials Science, Multidisciplinary	en
dc.subject.other	Agents	en
dc.subject.other	Curing	en
dc.subject.other	Drying	en
dc.subject.other	Elastic moduli	en
dc.subject.other	Epoxy resins	en
dc.subject.other	Mechanical properties	en
dc.subject.other	Tensile strength	en
dc.subject.other	Acid anhydride	en
dc.subject.other	Aramid/epoxy prepregs	en
dc.subject.other	Solid epoxy resin compounds	en
dc.subject.other	Fiber reinforced plastics	en
dc.title	Preparation and study of aramid/epoxy prepregs	en
heal.type	journalArticle	en
heal.identifier.primary	10.1007/BF00353049	en
heal.identifier.secondary	http://dx.doi.org/10.1007/BF00353049	en
heal.language	English	en
heal.publicationDate	1995	en
heal.abstract	Solid epoxy resin compounds were studied for their suitability as matrices for the preparation and curing of prepregs containing aramid fibres. Acid anhydrides were shown to be incompatible to the epoxy resin, producing a dispersed crystalline phase upon drying, whereas o-phenylenediamine is a miscible cross-linking agent. Also, diamine is safer because it reacts with the epoxy at temperatures considerably higher than the anhydrides. Composite specimens prepared by these prepregs display similar tensile strength and lower modulus than those derived from the one-step process, by the use of conventional liquid epoxy systems. © 1995 Chapman & Hall.	en
heal.publisher	Kluwer Academic Publishers	en
heal.journalName	Journal of Materials Science	en
dc.identifier.doi	10.1007/BF00353049	en
dc.identifier.isi	ISI:A1995QV97800038	en
dc.identifier.volume	30	en
dc.identifier.issue	8	en
dc.identifier.spage	2159	en
dc.identifier.epage	2162	en