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Sub-micrometre luminescent porous silicon structures using lithographically patterned substrates

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dc.contributor.author Nassiopoulos, AG en
dc.contributor.author Grigoropoulos, S en
dc.contributor.author Canham, L en
dc.contributor.author Halimaoui, A en
dc.contributor.author Berbezier, I en
dc.contributor.author Gogolides, E en
dc.contributor.author Papadimitriou, D en
dc.date.accessioned 2014-03-01T01:11:31Z
dc.date.available 2014-03-01T01:11:31Z
dc.date.issued 1995 en
dc.identifier.issn 0040-6090 en
dc.identifier.uri https://dspace.lib.ntua.gr/xmlui/handle/123456789/11676
dc.subject Chemical vapour deposition en
dc.subject Luminescence en
dc.subject Silicon en
dc.subject.classification Materials Science, Multidisciplinary en
dc.subject.classification Materials Science, Coatings & Films en
dc.subject.classification Physics, Applied en
dc.subject.classification Physics, Condensed Matter en
dc.subject.other Anodic oxidation en
dc.subject.other Chemical vapor deposition en
dc.subject.other Crystal growth en
dc.subject.other Luminescence en
dc.subject.other Photolithography en
dc.subject.other Photoluminescence en
dc.subject.other Scanning electron microscopy en
dc.subject.other Silica en
dc.subject.other Silicon nitride en
dc.subject.other Substrates en
dc.subject.other Surfaces en
dc.subject.other Transmission electron microscopy en
dc.subject.other Microphotoluminescence en
dc.subject.other Optical lithography en
dc.subject.other Pattern definition en
dc.subject.other Ultraviolet excitation en
dc.subject.other Porous silicon en
dc.title Sub-micrometre luminescent porous silicon structures using lithographically patterned substrates en
heal.type journalArticle en
heal.identifier.primary 10.1016/0040-6090(94)05675-4 en
heal.identifier.secondary http://dx.doi.org/10.1016/0040-6090(94)05675-4 en
heal.language English en
heal.publicationDate 1995 en
heal.abstract Sub-micrometre area porous silicon structures were fabricated by anodization of patterned surfaces of crystalline p-type silicon, orientation (100) and resistivity 5-7 Ωcm. The mask for selective anodization was either silicon dioxide or silicon nitride, deposited onto silicon by low pressure chemical vapour deposition. The second mask was more resistant to the anodization solution (HF, ethanol and water solution) and was not dissolved during the anodization time used. When silicon dioxide was used as a mask, care was taken to stop anodization before the whole layer was removed. Patterning was done by optical lithography combined with a special process for sub-micrometre dimensions (silylation process). Dots and lines of dimensions down to 0.5 μm were produced, which exhibit strong red luminescence under UV excitation. The film thickness of the porous silicon structures in the sub-micrometre areas was smaller than the thickness in larger areas. The lateral growth of the structures under the mask was examined by scanning and transmission electron microscopy. Microphotoluminescence experiments in a confocal microscope were also used for mapping the luminescent areas. © 1995. en
heal.publisher ELSEVIER SCIENCE SA LAUSANNE en
heal.journalName Thin Solid Films en
dc.identifier.doi 10.1016/0040-6090(94)05675-4 en
dc.identifier.isi ISI:A1995QB90000086 en
dc.identifier.volume 255 en
dc.identifier.issue 1-2 en
dc.identifier.spage 329 en
dc.identifier.epage 333 en


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