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Enhanced boiling heat transfer in porous layers with application to electronic component cooling

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dc.contributor.author Konstantinou, ND en
dc.contributor.author Stubos, AK en
dc.contributor.author Statharas, JC en
dc.contributor.author Kanellopoulos, NK en
dc.contributor.author Papaioannou, ACh en
dc.date.accessioned 2014-03-01T01:12:51Z
dc.date.available 2014-03-01T01:12:51Z
dc.date.issued 1997 en
dc.identifier.issn 1065-5131 en
dc.identifier.uri https://dspace.lib.ntua.gr/xmlui/handle/123456789/12265
dc.relation.uri http://www.scopus.com/inward/record.url?eid=2-s2.0-0030708484&partnerID=40&md5=31d064f9996a3c51156c5e85f3e7cbdd en
dc.subject Boiling en
dc.subject Electronic components cooling en
dc.subject Enhanced heat transfer en
dc.subject Numerical simulation en
dc.subject Porous media en
dc.subject Two-phase flow en
dc.subject.classification Thermodynamics en
dc.subject.classification Engineering, Mechanical en
dc.subject.other Boiling liquids en
dc.subject.other Computer simulation en
dc.subject.other Electronic equipment en
dc.subject.other Heat flux en
dc.subject.other Mechanical permeability en
dc.subject.other Phase transitions en
dc.subject.other Porosity en
dc.subject.other Porous materials en
dc.subject.other Thermal conductivity of solids en
dc.subject.other Two phase flow en
dc.subject.other Boiling heat transfer enhancement en
dc.subject.other Electronic component cooling en
dc.subject.other Heat transfer en
dc.title Enhanced boiling heat transfer in porous layers with application to electronic component cooling en
heal.type journalArticle en
heal.language English en
heal.publicationDate 1997 en
heal.abstract The present contribution deals with a continuous approach to modeling steady state evaporative heat transfer and vapor/liquid counterflow in porous media, in an attempt o identify the mechanisms responsible for the observed heat transfer enhancement during boiling of liquid coolants in porous layers. A 1-D computer code is developed solving the mass, momentum and energy conservation equations for a bottom and/or volumetrically heated, capillary porous medium. The limitations of such a macroscopic study are recognized and relate mainly to its inability to provide an insight of the micromechanics aspects at the pore level. Nevertheless, the macroscopic calculations are employed to highlight the effects of the relevant parameters (fluid properties, medium permeability and porosity, thermal conductivity of solid matrix, layer thickness) and identify the relative significance of the different mechanisms (capillarity, counter-flow, phase change). A simplified analytical approach is taken to describe the steady state thermohydraulic behaviour of a liquid saturated porous medium. This offers a fast, approximate method for predicting the limiting dryout heat flux in the porous layer. Qualitative agreement is obtained when the theoretical reproduction of the experimental boiling curves is attempted. Based on the understanding gained, investigations are underway to suggest geometric and thermal modifications of the system which may contribute to a significant increase of the heat flux removed in the case of electronic components cooling. en
heal.publisher GORDON BREACH SCI PUBL LTD en
heal.journalName Journal of Enhanced Heat Transfer en
dc.identifier.isi ISI:A1997XW01000002 en
dc.identifier.volume 4 en
dc.identifier.issue 3 en
dc.identifier.spage 175 en
dc.identifier.epage 186 en


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