Silylation of epoxy functionalised photoresists for optical, E - beam lithography and micromachining applications

Tegou, E; Gogolides, E; Argitis, P; Boudouvis, A; Hatzakis, M

dc.contributor.author	Tegou, E	en
dc.contributor.author	Gogolides, E	en
dc.contributor.author	Argitis, P	en
dc.contributor.author	Boudouvis, A	en
dc.contributor.author	Hatzakis, M	en
dc.date.accessioned	2014-03-01T01:14:09Z
dc.date.available	2014-03-01T01:14:09Z
dc.date.issued	1998	en
dc.identifier.issn	0167-9317	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/12893
dc.subject	Image Processing	en
dc.subject	Laser Interferometry	en
dc.subject	Process Development	en
dc.subject	Ultra Violet	en
dc.subject.classification	Engineering, Electrical & Electronic	en
dc.subject.classification	Nanoscience & Nanotechnology	en
dc.subject.classification	Optics	en
dc.subject.classification	Physics, Applied	en
dc.subject.other	Electron beams	en
dc.subject.other	Epoxy resins	en
dc.subject.other	Fourier transform infrared spectroscopy	en
dc.subject.other	Interferometry	en
dc.subject.other	Lithography	en
dc.subject.other	Silicon	en
dc.subject.other	Ultraviolet radiation	en
dc.subject.other	Silylation	en
dc.subject.other	Photoresists	en
dc.title	Silylation of epoxy functionalised photoresists for optical, E - beam lithography and micromachining applications	en
heal.type	journalArticle	en
heal.identifier.primary	10.1016/S0167-9317(98)00077-X	en
heal.identifier.secondary	http://dx.doi.org/10.1016/S0167-9317(98)00077-X	en
heal.language	English	en
heal.publicationDate	1998	en
heal.abstract	A near surface imaging process is developed for epoxy novolac photoresists using wet silylation and oxygen plasma development. The process is also suitable for gas phase silylation. Dimethyl dichloro silane (DMDCS) and chlorosilanes in general are used as silylating agents. The effective silicon incorporation is determined by FT-IR and laser interferometry. Resist formulation is optimized for dry development, the parameters affecting the resist profile are adjusted and process development is done using deep ultra violet (DUV) contact printing.	en
heal.publisher	ELSEVIER SCIENCE BV	en
heal.journalName	Microelectronic Engineering	en
dc.identifier.doi	10.1016/S0167-9317(98)00077-X	en
dc.identifier.isi	ISI:000073284600077	en
dc.identifier.volume	41-42	en
dc.identifier.spage	335	en
dc.identifier.epage	338	en