Method of lines for the calculation of excess capacitance for a cylindrical via hole in multilayer packaging

Papachristoforos, AP

dc.contributor.author	Papachristoforos, AP	en
dc.date.accessioned	2014-03-01T01:14:48Z
dc.date.available	2014-03-01T01:14:48Z
dc.date.issued	1999	en
dc.identifier.issn	1350-2417	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/13225
dc.subject.classification	Engineering, Electrical & Electronic	en
dc.subject.classification	Telecommunications	en
dc.subject.other	Capacitance	en
dc.subject.other	Computational geometry	en
dc.subject.other	Dielectric devices	en
dc.subject.other	Electric conductors	en
dc.subject.other	Electromagnetic wave propagation	en
dc.subject.other	Electronics packaging	en
dc.subject.other	Multilayers	en
dc.subject.other	Wave equations	en
dc.subject.other	Cylindrical via hole	en
dc.subject.other	Method of lines	en
dc.subject.other	Microstrip lines	en
dc.title	Method of lines for the calculation of excess capacitance for a cylindrical via hole in multilayer packaging	en
heal.type	journalArticle	en
heal.identifier.primary	10.1049/ip-map:19990449	en
heal.identifier.secondary	http://dx.doi.org/10.1049/ip-map:19990449	en
heal.language	English	en
heal.publicationDate	1999	en
heal.abstract	The method of lines (MOL) is extended for the analysis of different geometries that include both rectangular and cylindrical conductors. The method of analysis is valid for multilevel dielectric structures. The cylindrical conductors can have circular pads and rectangular microstrips that are attached to the pads or the main body of the cylindrical via (buried microstrips). The mixed structures can include many ground planes with circular openings through which the via passes. The results are compared with previous results.	en
heal.publisher	IEE, Stevenage, United Kingdom	en
heal.journalName	IEE Proceedings: Microwaves, Antennas and Propagation	en
dc.identifier.doi	10.1049/ip-map:19990449	en
dc.identifier.isi	ISI:000083239100009	en
dc.identifier.volume	146	en
dc.identifier.issue	4	en
dc.identifier.spage	285	en
dc.identifier.epage	291	en