Rapidly converging direct singular integral-equation techniques in the analysis of open microstrip lines on layered substrates

Tsalamengas, JL

dc.contributor.author	Tsalamengas, JL	en
dc.date.accessioned	2014-03-01T01:17:00Z
dc.date.available	2014-03-01T01:17:00Z
dc.date.issued	2001	en
dc.identifier.issn	0018-9480	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/14311
dc.subject	Integral equations	en
dc.subject	Layered media	en
dc.subject	Planar transmission lines	en
dc.subject.classification	Engineering, Electrical & Electronic	en
dc.subject.other	Layered substrates	en
dc.subject.other	Spectral integrals	en
dc.subject.other	Algorithms	en
dc.subject.other	Dispersion (waves)	en
dc.subject.other	Integral equations	en
dc.subject.other	Matrix algebra	en
dc.subject.other	Method of moments	en
dc.subject.other	Modal analysis	en
dc.subject.other	Optimization	en
dc.subject.other	Substrates	en
dc.subject.other	Microstrip lines	en
dc.title	Rapidly converging direct singular integral-equation techniques in the analysis of open microstrip lines on layered substrates	en
heal.type	journalArticle	en
heal.identifier.primary	10.1109/22.910563	en
heal.identifier.secondary	http://dx.doi.org/10.1109/22.910563	en
heal.language	English	en
heal.publicationDate	2001	en
heal.abstract	In this paper, moment-method-oriented direct singular integral-equation techniques are used for the exact analysis of planar layered microstrip lines. While these techniques retain the simplicity of the conventional method of moments, they optimize them by evaluating all matrix elements via rapidly converging real-axis spectral integrals. The proposed algorithms yield highly accurate results for the dispersion characteristics and for the modal currents both of the fundamental and higher order modes.	en
heal.publisher	IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC	en
heal.journalName	IEEE Transactions on Microwave Theory and Techniques	en
dc.identifier.doi	10.1109/22.910563	en
dc.identifier.isi	ISI:000167463500020	en
dc.identifier.volume	49	en
dc.identifier.issue	3	en
dc.identifier.spage	555	en
dc.identifier.epage	559	en