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MOSFET modeling and parameter extraction for low temperature analog circuit design

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dc.contributor.author Martin, P en
dc.contributor.author Bucher, M en
dc.contributor.author Enz, C en
dc.date.accessioned 2014-03-01T01:18:04Z
dc.date.available 2014-03-01T01:18:04Z
dc.date.issued 2002 en
dc.identifier.issn 1155-4339 en
dc.identifier.uri https://dspace.lib.ntua.gr/xmlui/handle/123456789/14782
dc.subject Analog Circuits en
dc.subject Flicker Noise en
dc.subject Infrared Imaging en
dc.subject Low Frequency Noise en
dc.subject Low Temperature en
dc.subject Parameter Extraction en
dc.subject Threshold Voltage en
dc.subject.classification Physics, Multidisciplinary en
dc.title MOSFET modeling and parameter extraction for low temperature analog circuit design en
heal.type journalArticle en
heal.identifier.primary 10.1109/WOLTE.2002.1022449 en
heal.identifier.secondary http://dx.doi.org/10.1109/WOLTE.2002.1022449 en
heal.language English en
heal.publicationDate 2002 en
heal.abstract SPICE parameters needed for simulation of CMOS readout circuits used in infrared image sensors cooled at low temperature are extracted using a specific MOSFET model based on the EKV 2.6 compact charge model. It is used below 200 K and is very well adapted to analog simulation in weak and moderate inversion regimes. It was successively applied on different CMOS processes from different foundries. The model's performance is demonstrated in this work for a 0.35 mum N+ single gate process. Experimental results on the evolution of the low frequency noise and the transistor matching parameters between 300 K and 77 K are also presented. Contrary to the NMOS transistors, the threshold voltage differences of buried channel PMOS transistors are less scattered as the temperature is lowered. The same trend with temperature is observed on the flicker noise parameter. en
heal.publisher E D P SCIENCES en
heal.journalName JOURNAL DE PHYSIQUE IV en
dc.identifier.doi 10.1109/WOLTE.2002.1022449 en
dc.identifier.isi ISI:000176971500011 en
dc.identifier.volume 12 en
dc.identifier.issue PR3 en
dc.identifier.spage 51 en
dc.identifier.epage 56 en


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