A pulse plating method for the electrosynthesis of ZnSe

Bouroushian, M; Kosanovic, T; Spyrellis, N

dc.contributor.author	Bouroushian, M	en
dc.contributor.author	Kosanovic, T	en
dc.contributor.author	Spyrellis, N	en
dc.date.accessioned	2014-03-01T01:23:30Z
dc.date.available	2014-03-01T01:23:30Z
dc.date.issued	2006	en
dc.identifier.issn	0021-891X	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/16983
dc.subject	Aqueous electrochemistry	en
dc.subject	Pulse electrodeposition	en
dc.subject	Thin film chalcogenides	en
dc.subject	Voltammetry	en
dc.subject	X-ray diffraction	en
dc.subject	Zinc selenide	en
dc.subject.classification	Electrochemistry	en
dc.subject.other	Electrodeposition	en
dc.subject.other	Polycrystalline materials	en
dc.subject.other	Scanning electron microscopy	en
dc.subject.other	Semiconductor materials	en
dc.subject.other	X ray diffraction analysis	en
dc.subject.other	Zinc compounds	en
dc.subject.other	Aqueous electrochemistry	en
dc.subject.other	Pulse electrodeposition	en
dc.subject.other	Thin film chalcogenides	en
dc.subject.other	Voltammetry	en
dc.subject.other	Zinc selenide	en
dc.subject.other	Thin films	en
dc.title	A pulse plating method for the electrosynthesis of ZnSe	en
heal.type	journalArticle	en
heal.identifier.primary	10.1007/s10800-006-9141-z	en
heal.identifier.secondary	http://dx.doi.org/10.1007/s10800-006-9141-z	en
heal.language	English	en
heal.publicationDate	2006	en
heal.abstract	Polycrystalline, thin films of ZnSe semiconductor compound were formed by cathodic electrodeposition from acidic aqueous selenite solutions of zinc sulphate, by using a potentiodynamic technique involving the application of repeated double pulses of controlled potential. Conditions for obtaining coherently uniform deposits with enhanced ZnSe to Se ratios were specified, on the basis of X-ray diffraction (XRD) and scanning electron microscopy results, by investigating the combined effect of the potential and length of each pulse as determined by duty cycle and frequency. It was shown that pulse plating process is a viable alternative to potentiostatic electrodeposition allowing improved control of the solid phase composition. © Springer 2006.	en
heal.publisher	SPRINGER	en
heal.journalName	Journal of Applied Electrochemistry	en
dc.identifier.doi	10.1007/s10800-006-9141-z	en
dc.identifier.isi	ISI:000239207400012	en
dc.identifier.volume	36	en
dc.identifier.issue	7	en
dc.identifier.spage	821	en
dc.identifier.epage	826	en