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Laser annealing for n+/p junction formation in germanium

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dc.contributor.author Tsouroutas, P en
dc.contributor.author Tsoukalas, D en
dc.contributor.author Florakis, A en
dc.contributor.author Zergioti, I en
dc.contributor.author Serafetinides, AA en
dc.contributor.author Cherkashin, N en
dc.contributor.author Marty, B en
dc.contributor.author Claverie, A en
dc.date.accessioned 2014-03-01T01:24:33Z
dc.date.available 2014-03-01T01:24:33Z
dc.date.issued 2006 en
dc.identifier.issn 1369-8001 en
dc.identifier.uri https://dspace.lib.ntua.gr/xmlui/handle/123456789/17329
dc.subject Germanium en
dc.subject Laser annealing en
dc.subject n+/p junction en
dc.subject Recrystallization en
dc.subject.classification Engineering, Electrical & Electronic en
dc.subject.classification Materials Science, Multidisciplinary en
dc.subject.classification Physics, Applied en
dc.subject.classification Physics, Condensed Matter en
dc.subject.other Annealing en
dc.subject.other Germanium en
dc.subject.other Laser applications en
dc.subject.other Neodymium en
dc.subject.other Recrystallization (metallurgy) en
dc.subject.other Semiconductor doping en
dc.subject.other Substrates en
dc.subject.other Transmission electron microscopy en
dc.subject.other Dopant diffusion en
dc.subject.other Dopants en
dc.subject.other Laser annealing en
dc.subject.other Semiconductor junctions en
dc.title Laser annealing for n+/p junction formation in germanium en
heal.type journalArticle en
heal.identifier.primary 10.1016/j.mssp.2006.08.013 en
heal.identifier.secondary http://dx.doi.org/10.1016/j.mssp.2006.08.013 en
heal.language English en
heal.publicationDate 2006 en
heal.abstract In the present work we focus our study on laser annealing of implanted with high phosphorus dose p-type germanium wafers using an Nd-YAG laser at 355 nm. Dopant profiles as monitored by SIMS measurements demonstrate dopant profile movement less than 15 nm at junction depth. Germanium (Ge) structural defects were observed by TEM measurements and the roughness of the surface was measured by AFM. The above analysis shows the efficiency of laser annealing in recrystallizing the Ge substrates at lower energy fluences compared to Si and without substantial dopant loss and diffusion. (C) 2006 Elsevier Ltd. All rights reserved. en
heal.publisher ELSEVIER SCI LTD en
heal.journalName Materials Science in Semiconductor Processing en
dc.identifier.doi 10.1016/j.mssp.2006.08.013 en
dc.identifier.isi ISI:000243574100041 en
dc.identifier.volume 9 en
dc.identifier.issue 4-5 SPEC. ISS. en
dc.identifier.spage 644 en
dc.identifier.epage 649 en


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