Design and fabrication of a Si micromechanical capacitive array for DNA sensing

Tsouti, V; Chatzandroulis, S; Goustouridis, D; Normand, P; Tsoukalas, D

dc.contributor.author	Tsouti, V	en
dc.contributor.author	Chatzandroulis, S	en
dc.contributor.author	Goustouridis, D	en
dc.contributor.author	Normand, P	en
dc.contributor.author	Tsoukalas, D	en
dc.date.accessioned	2014-03-01T01:28:07Z
dc.date.available	2014-03-01T01:28:07Z
dc.date.issued	2008	en
dc.identifier.issn	0167-9317	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/18714
dc.subject	Biosensor	en
dc.subject	Capacitive detection	en
dc.subject	Finite element analysis	en
dc.subject	Membrane array	en
dc.subject.classification	Engineering, Electrical & Electronic	en
dc.subject.classification	Nanoscience & Nanotechnology	en
dc.subject.classification	Optics	en
dc.subject.classification	Physics, Applied	en
dc.subject.other	Biosensors	en
dc.subject.other	Cell membranes	en
dc.subject.other	DNA	en
dc.subject.other	Finite element method	en
dc.subject.other	Optimization	en
dc.subject.other	Silicon compounds	en
dc.subject.other	Capacitive detection	en
dc.subject.other	Membrane array	en
dc.subject.other	Microarrays	en
dc.title	Design and fabrication of a Si micromechanical capacitive array for DNA sensing	en
heal.type	journalArticle	en
heal.identifier.primary	10.1016/j.mee.2007.12.075	en
heal.identifier.secondary	http://dx.doi.org/10.1016/j.mee.2007.12.075	en
heal.language	English	en
heal.publicationDate	2008	en
heal.abstract	The design considerations and the fabrication process of a single chip capacitive sensor array suitable for chemical and DNA sensing are presented. Each sensor in the array consists of an ultra thin silicon membrane to be covered with receptor DNA. Upon exertion of surface stress, the membrane deflects resulting in a change in device capacitance. Finite element analysis (FEA) was applied to evaluate and optimize the response of the sensor. First experimental results on chemical substances are reported. (c) 2008 Elsevier B.V. All rights reserved.	en
heal.publisher	ELSEVIER SCIENCE BV	en
heal.journalName	Microelectronic Engineering	en
dc.identifier.doi	10.1016/j.mee.2007.12.075	en
dc.identifier.isi	ISI:000257413400156	en
dc.identifier.volume	85	en
dc.identifier.issue	5-6	en
dc.identifier.spage	1359	en
dc.identifier.epage	1361	en