Effect of substrate temperature and roughness on the solidification of copper plasma sprayed droplets

Christoulis, DK; Pantelis, DI; De Dave-Fabregue, N; Borit, F; Guipont, V; Jeandin, M

dc.contributor.author	Christoulis, DK	en
dc.contributor.author	Pantelis, DI	en
dc.contributor.author	De Dave-Fabregue, N	en
dc.contributor.author	Borit, F	en
dc.contributor.author	Guipont, V	en
dc.contributor.author	Jeandin, M	en
dc.date.accessioned	2014-03-01T01:28:13Z
dc.date.available	2014-03-01T01:28:13Z
dc.date.issued	2008	en
dc.identifier.issn	0921-5093	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/18765
dc.subject	Plasma sprayed splat	en
dc.subject	Solidification	en
dc.subject	Substrate roughness	en
dc.subject	Substrate temperature	en
dc.subject.classification	Nanoscience & Nanotechnology	en
dc.subject.classification	Materials Science, Multidisciplinary	en
dc.subject.other	Adhesion	en
dc.subject.other	Coating techniques	en
dc.subject.other	Electron probe microanalysis	en
dc.subject.other	Morphology	en
dc.subject.other	Porosity	en
dc.subject.other	Scanning electron microscopy	en
dc.subject.other	Solidification	en
dc.subject.other	Surface roughness	en
dc.subject.other	Temperature	en
dc.subject.other	Plasma sprayed splat	en
dc.subject.other	Splats morphology	en
dc.subject.other	Copper	en
dc.subject.other	Adhesion	en
dc.subject.other	Coating techniques	en
dc.subject.other	Copper	en
dc.subject.other	Electron probe microanalysis	en
dc.subject.other	Morphology	en
dc.subject.other	Porosity	en
dc.subject.other	Scanning electron microscopy	en
dc.subject.other	Solidification	en
dc.subject.other	Surface roughness	en
dc.subject.other	Temperature	en
dc.title	Effect of substrate temperature and roughness on the solidification of copper plasma sprayed droplets	en
heal.type	journalArticle	en
heal.identifier.primary	10.1016/j.msea.2007.07.059	en
heal.identifier.secondary	http://dx.doi.org/10.1016/j.msea.2007.07.059	en
heal.language	English	en
heal.publicationDate	2008	en
heal.abstract	Flattening of an individual thermal sprayed particle on the substrate is a fundamental process for the coating formation. Coating properties such as porosity and adhesion depend strongly from the splats morphology. Also, the microstructure of the coating depends on the nucleation and the grain growth during splats solidification. The influence of the substrate temperature and roughness on the microstructure of copper splats was examined in the present study. Copper (-90 + 45 mu m) was plasma sprayed under atmospheric conditions on mirror polished (R-a similar to 0.02 mu m) and on grit-blasted (R-a similar to 1.33 mu m) stainless steel substrates (AISI 304L). The substrates were preheated at three different temperatures: 200 degrees C, 250 degrees C and 300 degrees C. A Schottky field emission scanning electron microscope (SFE-SEM) was used in order to study the splats microstructure. In order to measure the grain size of the splats, image analysis software was used, while the chemical composition of the splats was studied by an electron probe microanalysis (EPMA). It was found that the splats cooling velocity is decreased with the increase of substrate temperature above the transition temperature. Also a further decrease of splats cooling velocity was provoked by increasing the mean substrate roughness. (C) 2007 Elsevier B.V. All rights reserved.	en
heal.publisher	ELSEVIER SCIENCE SA	en
heal.journalName	Materials Science and Engineering A	en
dc.identifier.doi	10.1016/j.msea.2007.07.059	en
dc.identifier.isi	ISI:000256194300018	en
dc.identifier.volume	485	en
dc.identifier.issue	1-2	en
dc.identifier.spage	119	en
dc.identifier.epage	129	en