Influence of pulse plating conditions on the structure and properties of pure and composite nickel nanocrystalline coatings

Pavlatou, EA; Spyrellis, N

dc.contributor.author	Pavlatou, EA	en
dc.contributor.author	Spyrellis, N	en
dc.date.accessioned	2014-03-01T01:28:41Z
dc.date.available	2014-03-01T01:28:41Z
dc.date.issued	2008	en
dc.identifier.issn	1023-1935	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/18913
dc.subject	Composite coatings	en
dc.subject	Hardness	en
dc.subject	Nanocrystalline	en
dc.subject	Nickel electrodeposition	en
dc.subject	Organic additives	en
dc.subject	Preferred orientation	en
dc.subject	Pulse plating	en
dc.subject.classification	Electrochemistry	en
dc.subject.other	Additives	en
dc.subject.other	Composite coatings	en
dc.subject.other	Deposits	en
dc.subject.other	Doping (additives)	en
dc.subject.other	Electrodeposition	en
dc.subject.other	Electroplating	en
dc.subject.other	Food additives	en
dc.subject.other	Lead	en
dc.subject.other	Lead deposits	en
dc.subject.other	Materials properties	en
dc.subject.other	Mechanical properties	en
dc.subject.other	Metallic matrix composites	en
dc.subject.other	Metallizing	en
dc.subject.other	Nanocrystalline alloys	en
dc.subject.other	Nanocrystalline materials	en
dc.subject.other	Nanostructured materials	en
dc.subject.other	Nickel	en
dc.subject.other	Nickel alloys	en
dc.subject.other	Nickel deposits	en
dc.subject.other	Nickel plating	en
dc.subject.other	Parameter estimation	en
dc.subject.other	Reduction	en
dc.subject.other	Silicon carbide	en
dc.subject.other	Surface structure	en
dc.subject.other	Well stimulation	en
dc.subject.other	(1 1 0) surface	en
dc.subject.other	(I ,J) conditions	en
dc.subject.other	(PL) properties	en
dc.subject.other	2-Butyne	en
dc.subject.other	Electrocoatings	en
dc.subject.other	In order	en
dc.subject.other	Nano crystalline	en
dc.subject.other	Nano-SiC	en
dc.subject.other	Nano-structured	en
dc.subject.other	Nanocrystalline coatings	en
dc.subject.other	Nickel matrix composite	en
dc.subject.other	Organic additives	en
dc.subject.other	Pulse currents	en
dc.subject.other	Pulse electrodeposition	en
dc.subject.other	pulse techniques	en
dc.subject.other	Pulse-plating (PP)	en
dc.subject.other	Structural characteristics	en
dc.subject.other	Structure and properties	en
dc.subject.other	Ultrafine (CO)	en
dc.subject.other	Watts type bath	en
dc.subject.other	WC particles	en
dc.subject.other	Structural properties	en
dc.title	Influence of pulse plating conditions on the structure and properties of pure and composite nickel nanocrystalline coatings	en
heal.type	journalArticle	en
heal.identifier.primary	10.1134/S1023193508060165	en
heal.identifier.secondary	http://dx.doi.org/10.1134/S1023193508060165	en
heal.language	English	en
heal.publicationDate	2008	en
heal.abstract	An additive-free Watts type bath containing micron- and nano-SiC particles (1 μm and 20 nm respectively), as well as ultrafine-WC particles (200 nm), was used for the production of pure Ni and nickel matrix composite electrocoatings under both direct and pulse current conditions. Moreover, nickel nanocrystalline deposits were obtained from a Watts type bath containing small amounts of 2-butyne-1,4-diol, in order to investigate the combined advantages of additives and pulse technique on the properties of the deposits. The influence of the variable electrolysis parameters, the particle size and the organic additive concentration on the surface morphology, the structure and properties of the deposits were discussed. It has been proved that the application of pulse electrodeposition affects drastically the structural characteristics and properties of the deposits and under well-defined conditions could lead to the preparation of nanostructured materials with improved mechanical properties. © 2008 MAIK Nauka.	en
heal.publisher	MAIK NAUKA/INTERPERIODICA/SPRINGER	en
heal.journalName	Russian Journal of Electrochemistry	en
dc.identifier.doi	10.1134/S1023193508060165	en
dc.identifier.isi	ISI:000257332100016	en
dc.identifier.volume	44	en
dc.identifier.issue	6	en
dc.identifier.spage	745	en
dc.identifier.epage	754	en