dc.contributor.author |
Marchal, P |
en |
dc.contributor.author |
Bougard, B |
en |
dc.contributor.author |
Katti, G |
en |
dc.contributor.author |
Stucchi, M |
en |
dc.contributor.author |
Dehaene, W |
en |
dc.contributor.author |
Papanikolaou, A |
en |
dc.contributor.author |
Verkest, D |
en |
dc.contributor.author |
Swinnen, B |
en |
dc.contributor.author |
Beyne, E |
en |
dc.date.accessioned |
2014-03-01T01:29:29Z |
|
dc.date.available |
2014-03-01T01:29:29Z |
|
dc.date.issued |
2009 |
en |
dc.identifier.issn |
00189219 |
en |
dc.identifier.uri |
https://dspace.lib.ntua.gr/xmlui/handle/123456789/19280 |
|
dc.subject |
Design automation |
en |
dc.subject |
Design centering |
en |
dc.subject |
Integrated circuit design |
en |
dc.subject |
Technology assessment |
en |
dc.subject.other |
Computer aided design |
en |
dc.subject.other |
Integrated circuit manufacture |
en |
dc.subject.other |
Integrated circuits |
en |
dc.subject.other |
Semiconducting indium |
en |
dc.subject.other |
Semiconductor device manufacture |
en |
dc.subject.other |
Strategic planning |
en |
dc.subject.other |
Technological forecasting |
en |
dc.subject.other |
Three dimensional |
en |
dc.subject.other |
Design automation |
en |
dc.subject.other |
Design centering |
en |
dc.subject.other |
Design options |
en |
dc.subject.other |
Design strategies |
en |
dc.subject.other |
Holistic approaches |
en |
dc.subject.other |
Integrated circuit design |
en |
dc.subject.other |
Moore's laws |
en |
dc.subject.other |
Path findings |
en |
dc.subject.other |
Road maps |
en |
dc.subject.other |
Semiconductor industries |
en |
dc.subject.other |
System designs |
en |
dc.subject.other |
Technology assessment |
en |
dc.subject.other |
Technology development |
en |
dc.subject.other |
Technology options |
en |
dc.subject.other |
Test strategies |
en |
dc.subject.other |
Technology |
en |
dc.title |
3-D technology assessment: Path-finding the technology/design sweet-spot |
en |
heal.type |
journalArticle |
en |
heal.identifier.primary |
10.1109/JPROC.2008.2007471 |
en |
heal.identifier.secondary |
http://dx.doi.org/10.1109/JPROC.2008.2007471 |
en |
heal.identifier.secondary |
4796274 |
en |
heal.publicationDate |
2009 |
en |
heal.abstract |
It is widely acknowledged that three-dimensional (3-D) technologies offer numerous opportunities for system design. In recent years, significant progress has been made on these 3-D technologies, and they have become probably the best hope for carrying the semiconductor industry beyond the path of Moore's law. However, a clear roadmap is missing to successfully introduce this 3-D technology onto the market. Today, a plurality of 3-D technology options exists, which requires different design and test strategies. To crystallize the many technology options in a few mainstream technologies, it is mandatory to coexplore both technology and design options. The contribution of this paper is to introduce a novel path finding methodology to untangle the many intertwined design/technology options. This holistic approach will be applied on a representative 3-D case study. Initial results demonstrate the benefits of the proposed path-finding methodology to steer the technology development and fine-tune design strategies. © 2006 IEEE. |
en |
heal.journalName |
Proceedings of the IEEE |
en |
dc.identifier.doi |
10.1109/JPROC.2008.2007471 |
en |
dc.identifier.volume |
97 |
en |
dc.identifier.issue |
1 |
en |
dc.identifier.spage |
96 |
en |
dc.identifier.epage |
107 |
en |