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Production of copper powder from printed circuit boards by electrodeposition

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dc.contributor.author Masavetas, I en
dc.contributor.author Moutsatsou, A en
dc.contributor.author Nikolaou, E en
dc.contributor.author Spanou, S en
dc.contributor.author Zoikis-Karathanasis, A en
dc.contributor.author Pavlatou, EA en
dc.contributor.author Spyrellis, N en
dc.date.accessioned 2014-03-01T01:31:42Z
dc.date.available 2014-03-01T01:31:42Z
dc.date.issued 2009 en
dc.identifier.issn 1790-7632 en
dc.identifier.uri https://dspace.lib.ntua.gr/xmlui/handle/123456789/19899
dc.relation.uri http://www.scopus.com/inward/record.url?eid=2-s2.0-79955056497&partnerID=40&md5=51f344ed9bf0cd4b895fe808147ffff8 en
dc.subject Cu powder en
dc.subject Cu recovery en
dc.subject Electrowinning en
dc.subject Leaching en
dc.subject Printed circuit boards en
dc.subject.classification Environmental Sciences en
dc.subject.other RECOVERY en
dc.subject.other SULFATE en
dc.title Production of copper powder from printed circuit boards by electrodeposition en
heal.type journalArticle en
heal.language English en
heal.publicationDate 2009 en
heal.abstract During the last years, the waste electrical and electronic equipment (WEEE) are gathering attention, as a very special section of waste. In fact, they have been proven to be source for the recovery of metals. In the present study printed circuit boards (PCBs) were cut and treated thermally at 500°C for 1 h in both air and nitrogen atmosphere. The obtained material was dissolved in three different acid media HNO3aq, HClaq and H2SO4aq, in order to extract copper. The achieved Cu recovery percentages were 97.5, 65 and 76.5% respectively. Electrodeposition technique was applied in order to recover copper in powder form. More than 98% of copper was recovered achieved by application of high current density resulting to dendritic structure of copper. The applied process was characterised by a high current efficiency and led to the production of copper powder of 80 μm mean diameter appropriate for powder metallurgy applications. © 2009 Global NEST. en
heal.publisher GLOBAL NETWORK ENVIRONMENTAL SCIENCE & TECHNOLOGY en
heal.journalName Global Nest Journal en
dc.identifier.isi ISI:000273757700016 en
dc.identifier.volume 11 en
dc.identifier.issue 2 en
dc.identifier.spage 241 en
dc.identifier.epage 247 en


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