Nanocrystalline Ni-W coatings on copper

Panagopoulos, CN; Plainakis, GD; Lagaris, DA

dc.contributor.author	Panagopoulos, CN	en
dc.contributor.author	Plainakis, GD	en
dc.contributor.author	Lagaris, DA	en
dc.date.accessioned	2014-03-01T01:36:22Z
dc.date.available	2014-03-01T01:36:22Z
dc.date.issued	2011	en
dc.identifier.issn	0921-5107	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/21294
dc.subject	Nickel	en
dc.subject	Tungsten	en
dc.subject	Coating	en
dc.subject	Adhesion	en
dc.subject.classification	Materials Science, Multidisciplinary	en
dc.subject.classification	Physics, Condensed Matter	en
dc.subject.other	ALLOYS	en
dc.subject.other	ELECTRODEPOSITION	en
dc.title	Nanocrystalline Ni-W coatings on copper	en
heal.type	journalArticle	en
heal.identifier.primary	10.1016/j.mseb.2010.03.058	en
heal.identifier.secondary	http://dx.doi.org/10.1016/j.mseb.2010.03.058	en
heal.language	English	en
heal.publicationDate	2011	en
heal.abstract	Nanocrystalline Ni-W coatings were produced on copper substrates with the aid of electrodeposition technique. The morphology, chemical composition and structure of the produced coatings were examined with the aid of scanning electron microscopy (SEM), electron dispersive spectroscopy (EDS) and X-ray diffraction (XRD) techniques. The microhardness of alloy Ni-W coatings on copper substrate was also studied. The adhesion between the Ni-W coating, having W content 50 wt%, and the copper substrate, was also studied with a scratch testing apparatus. The scratch tests resulted in the coatings suffering an intensive brittle fracture and minor delamination. (C) 2010 Elsevier B.V. All rights reserved.	en
heal.publisher	ELSEVIER SCIENCE BV	en
heal.journalName	MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS	en
dc.identifier.doi	10.1016/j.mseb.2010.03.058	en
dc.identifier.isi	ISI:000289920600004	en
dc.identifier.volume	176	en
dc.identifier.issue	6	en
dc.identifier.spage	477	en
dc.identifier.epage	479	en