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On supporting rapid thermal analysis

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dc.contributor.author Siozios, K en
dc.contributor.author Rodopoulos, D en
dc.contributor.author Soudris, D en
dc.date.accessioned 2014-03-01T01:36:33Z
dc.date.available 2014-03-01T01:36:33Z
dc.date.issued 2011 en
dc.identifier.issn 1556-6056 en
dc.identifier.uri https://dspace.lib.ntua.gr/xmlui/handle/123456789/21330
dc.subject Computer Systems Organization en
dc.subject Hardware en
dc.subject Modeling techniques en
dc.subject Performance of Systems en
dc.subject Power Management en
dc.subject Reconfigurable hardware en
dc.subject.other Computer systems organization en
dc.subject.other Modeling techniques en
dc.subject.other Performance of systems en
dc.subject.other Power managements en
dc.subject.other Re-configurable en
dc.subject.other Computer hardware en
dc.subject.other Energy management en
dc.subject.other Reconfigurable hardware en
dc.subject.other Thermoanalysis en
dc.subject.other Open systems en
dc.title On supporting rapid thermal analysis en
heal.type journalArticle en
heal.identifier.primary 10.1109/L-CA.2011.19 en
heal.identifier.secondary http://dx.doi.org/10.1109/L-CA.2011.19 en
heal.identifier.secondary 5962328 en
heal.language English en
heal.publicationDate 2011 en
heal.abstract Detailed thermal analysis is usually performed exclusively at design time since it is a computationally intensive task. In this paper, we introduce a novel methodology for fast, yet accurate, thermal analysis. The introduced methodology is software supported by a new open source tool that enables hierarchical thermal analysis with adaptive levels of granularity. Experimental results prove the efficiency of our approach since it leads to average reduction of the execution overhead up to 70 with a penalty in accuracy ranging between 2 and 8. © 2011 Published by the IEEE Computer Society. en
heal.publisher IEEE COMPUTER SOC en
heal.journalName IEEE Computer Architecture Letters en
dc.identifier.doi 10.1109/L-CA.2011.19 en
dc.identifier.isi ISI:000297572300007 en
dc.identifier.volume 10 en
dc.identifier.issue 2 en
dc.identifier.spage 53 en
dc.identifier.epage 56 en


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