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Crystal growth inhibition in nickel electro-deposition under pulse reversed current conditions

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dc.contributor.author Kollia, C en
dc.contributor.author Spyrellis, N en
dc.date.accessioned 2014-03-01T01:42:32Z
dc.date.available 2014-03-01T01:42:32Z
dc.date.issued 1994 en
dc.identifier.issn 00202967 en
dc.identifier.uri https://dspace.lib.ntua.gr/xmlui/handle/123456789/23867
dc.relation.uri http://www.scopus.com/inward/record.url?eid=2-s2.0-0028494312&partnerID=40&md5=977cbe0d879f56f1ece4f980aae63539 en
dc.subject.other Crystal growth en
dc.subject.other Electric current measurement en
dc.subject.other Microstructure en
dc.subject.other Morphology en
dc.subject.other Nickel en
dc.subject.other Textures en
dc.subject.other Crystal growth inhibition en
dc.subject.other Pulse reversed current en
dc.subject.other Electrodeposition en
dc.title Crystal growth inhibition in nickel electro-deposition under pulse reversed current conditions en
heal.type journalArticle en
heal.publicationDate 1994 en
heal.abstract The application of pulse reversed current (P.R.C.) in nickel electrodeposition introduces two more parameters regarding the choice of plating conditions: the pulse frequency and the duty cycle. Starting from well defined electrolytic conditions, leading to perfectly [100] textured deposits prepared from an organic-free Watts type bath under direct current (d.c.) regime, it is proved that: the variation of the P.R.C. parameters modifies the texture, the microstructure and the surface morphology of nickel electrodeposits. The change of the deposit properties is directly related to the crystal growth perturbation caused by specific inhibitors which are formed mainly during the reversal of the electrolytic cell polarity and the dissolution of the metal. en
heal.publisher Inst of Metal Finishing, Birmingham, United Kingdom en
heal.journalName Transactions of the Institute of Metal Finishing en
dc.identifier.volume 72 en
dc.identifier.issue pt 3 en
dc.identifier.spage 124 en
dc.identifier.epage 126 en


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