dc.contributor.author |
Filindras, A |
en |
dc.contributor.author |
Larson, UO |
en |
dc.contributor.author |
Ling, H |
en |
dc.date.accessioned |
2014-03-01T01:44:50Z |
|
dc.date.available |
2014-03-01T01:44:50Z |
|
dc.date.issued |
1996 |
en |
dc.identifier.issn |
09205071 |
en |
dc.identifier.uri |
https://dspace.lib.ntua.gr/xmlui/handle/123456789/24502 |
|
dc.relation.uri |
http://www.scopus.com/inward/record.url?eid=2-s2.0-0029711135&partnerID=40&md5=1761f877a5c51b501eef5a7c1f1fad4c |
en |
dc.subject.other |
Data reduction |
en |
dc.subject.other |
Dielectric materials |
en |
dc.subject.other |
Estimation |
en |
dc.subject.other |
Fourier transforms |
en |
dc.subject.other |
Frequency domain analysis |
en |
dc.subject.other |
Time domain analysis |
en |
dc.subject.other |
Electromagnetic code consortium dielectric slab configuration |
en |
dc.subject.other |
Two dimensional moment method |
en |
dc.subject.other |
Electromagnetic wave backscattering |
en |
dc.title |
Scattering from the EMCC dielectric slabs: Simulation and phenomenology interpretation |
en |
heal.type |
journalArticle |
en |
heal.publicationDate |
1996 |
en |
heal.abstract |
The scattering phenomenology in the EMCC (Electromagnetic Code Consortium) dielectric slab configuration with and without metal backing is studied. The scattering data are first simulated via a two-dimensional moment method solution. The resulting frequency domain data are initially compared to measurement data provided by EMCC. They are then transformed to the time domain, where the backscattering mechanisms are resolved and interpreted. Next, the scattering data are analyzed in the joint time-frequency domain via the short-time Fourier transform. In the Joint lime-frequency plane, dispersive surface wave mechanisms and guided wave modes are more easily pinpointed, providing us with further insights into the scattering physics of the structures. |
en |
heal.journalName |
Journal of Electromagnetic Waves and Applications |
en |
dc.identifier.volume |
10 |
en |
dc.identifier.issue |
4 |
en |
dc.identifier.spage |
515 |
en |
dc.identifier.epage |
534 |
en |