dc.contributor.author |
Tsoukalas, D |
en |
dc.contributor.author |
Tsamis, C |
en |
dc.contributor.author |
Kouvatsos, D |
en |
dc.contributor.author |
Revva, P |
en |
dc.contributor.author |
Tsoi, E |
en |
dc.date.accessioned |
2014-03-01T01:45:44Z |
|
dc.date.available |
2014-03-01T01:45:44Z |
|
dc.date.issued |
1997 |
en |
dc.identifier.uri |
https://dspace.lib.ntua.gr/xmlui/handle/123456789/24718 |
|
dc.subject |
Device Simulation |
en |
dc.subject |
Point Defect |
en |
dc.subject |
Silicon On Insulator |
en |
dc.subject |
Threshold Voltage |
en |
dc.subject |
Short Channel Effect |
en |
dc.title |
Reduction of the reverse short channel effect in thick SOI MOSFET's |
en |
heal.type |
journalArticle |
en |
heal.identifier.primary |
10.1109/55.556090 |
en |
heal.identifier.secondary |
http://dx.doi.org/10.1109/55.556090 |
en |
heal.publicationDate |
1997 |
en |
heal.abstract |
We show that the reverse short channel effect (RSCE) is reduced in NMOS devices made in thick silicon-on-insulator (SOI) material. The reduction of the RSCE depends on the thickness of the Si overlayer. It is found that the thinner the Si film, the less the threshold voltage roll-on. The experimental findings are explained by a decrease of the lateral distribution |
en |
heal.journalName |
IEEE Electron Device Letters |
en |
dc.identifier.doi |
10.1109/55.556090 |
en |