Ultraminiature silicon capacitive pressure-sensing elements obtained by silicon fusion bonding

Goustouridis, D; Normand, P; Tsoukalas, D

dc.contributor.author	Goustouridis, D	en
dc.contributor.author	Normand, P	en
dc.contributor.author	Tsoukalas, D	en
dc.date.accessioned	2014-03-01T01:47:03Z
dc.date.available	2014-03-01T01:47:03Z
dc.date.issued	1998	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/25125
dc.subject	Blood Pressure Measurement	en
dc.subject	Ion Implantation	en
dc.subject	Pressure Sensor	en
dc.title	Ultraminiature silicon capacitive pressure-sensing elements obtained by silicon fusion bonding	en
heal.type	journalArticle	en
heal.identifier.primary	10.1016/S0924-4247(98)00016-8	en
heal.identifier.secondary	http://dx.doi.org/10.1016/S0924-4247(98)00016-8	en
heal.publicationDate	1998	en
heal.abstract	We present a technology to fabricate ultraminiature capacitive-type sensing elements for use in blood-pressure measurements, each of them having a side dimension of only 130 μm. The devices, which are made in an array configuration, are fabricated using the silicon fusionbonding technique and self-aligned boron ion implantation. The process is simple, requiring only three mask levels, and has high yield.	en
heal.journalName	Sensors and Actuators A-physical	en
dc.identifier.doi	10.1016/S0924-4247(98)00016-8	en