3-D-integrated RF and millimeter-wave functions and modules using liquid crystal polymer (LCP) system-on-package technology

Tentzeris, M; Laskar, J; Papapolymerou, J; Pinel, S; Palazzari, V; Li, R; DeJean, G; Papageorgiou, N; Thompson, D; Bairavasubramanian, R; Sarkar, S; Lee, J

dc.contributor.author	Tentzeris, M	en
dc.contributor.author	Laskar, J	en
dc.contributor.author	Papapolymerou, J	en
dc.contributor.author	Pinel, S	en
dc.contributor.author	Palazzari, V	en
dc.contributor.author	Li, R	en
dc.contributor.author	DeJean, G	en
dc.contributor.author	Papageorgiou, N	en
dc.contributor.author	Thompson, D	en
dc.contributor.author	Bairavasubramanian, R	en
dc.contributor.author	Sarkar, S	en
dc.contributor.author	Lee, J	en
dc.date.accessioned	2014-03-01T01:53:15Z
dc.date.available	2014-03-01T01:53:15Z
dc.date.issued	2004	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/26900
dc.subject	Antenna Array	en
dc.subject	Integrated Approach	en
dc.subject	Liquid Crystal Polymer	en
dc.subject	Millimeter Wave	en
dc.subject	Module System	en
dc.subject	Three Dimensional	en
dc.subject	Wireless Communication	en
dc.subject	Front End	en
dc.subject	Single Input Single Output	en
dc.subject	System On Package	en
dc.title	3-D-integrated RF and millimeter-wave functions and modules using liquid crystal polymer (LCP) system-on-package technology	en
heal.type	journalArticle	en
heal.identifier.primary	10.1109/TADVP.2004.828814	en
heal.identifier.secondary	http://dx.doi.org/10.1109/TADVP.2004.828814	en
heal.publicationDate	2004	en
heal.abstract	Electronics packaging evolution involves system, technology, and material considerations. In this paper, we present a novel three-dimensional (3-D) integration approach for system-on-package (SOP)-based solutions for wireless communication applications. This concept is proposed for the 3-D integration of RF and millimeter (mm) wave embedded functions in front-end modules by means of stacking substrates using liquid crystal polymer (LCP) multilayer and μBGA	en
heal.journalName	IEEE Transactions on Components, Packaging and Manufacturing Technology	en
dc.identifier.doi	10.1109/TADVP.2004.828814	en