Effect of substrate temperature and roughness on the solidification of copper plasma sprayed droplets

Christoulis, D; Pantelis, D; Dave-Fabrègue, N; Borit, F; Guipont, V; Jeandin, M

dc.contributor.author	Christoulis, D	en
dc.contributor.author	Pantelis, D	en
dc.contributor.author	Dave-Fabrègue, N	en
dc.contributor.author	Borit, F	en
dc.contributor.author	Guipont, V	en
dc.contributor.author	Jeandin, M	en
dc.date.accessioned	2014-03-01T01:56:41Z
dc.date.available	2014-03-01T01:56:41Z
dc.date.issued	2008	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/28214
dc.subject	Chemical Composition	en
dc.subject	Copper	en
dc.subject	Electron Probe Microanalysis	en
dc.subject	Grain Growth	en
dc.subject	Grain Size	en
dc.subject	Image Analysis	en
dc.subject	Microstructures	en
dc.subject	Plasma Spraying	en
dc.subject	Field Emission Scanning Electron Microscope	en
dc.subject	Stainless Steel	en
dc.title	Effect of substrate temperature and roughness on the solidification of copper plasma sprayed droplets	en
heal.type	journalArticle	en
heal.identifier.primary	10.1016/j.msea.2007.07.059	en
heal.identifier.secondary	http://dx.doi.org/10.1016/j.msea.2007.07.059	en
heal.publicationDate	2008	en
heal.abstract	Flattening of an individual thermal sprayed particle on the substrate is a fundamental process for the coating formation. Coating properties such as porosity and adhesion depend strongly from the splats morphology. Also, the microstructure of the coating depends on the nucleation and the grain growth during splats solidification. The influence of the substrate temperature and roughness on the microstructure of	en
heal.journalName	Materials Science and Engineering A-structural Materials Properties Microstructure and Processing	en
dc.identifier.doi	10.1016/j.msea.2007.07.059	en