Process controL through dieLectric monitoring

Maistros, G; Pantelelis, N; Mccarthy, N; Boiteux, G; Hartley, J; Seytre, G; Wheatley, R; Hakme, C

dc.contributor.author	Maistros, G	en
dc.contributor.author	Pantelelis, N	en
dc.contributor.author	Mccarthy, N	en
dc.contributor.author	Boiteux, G	en
dc.contributor.author	Hartley, J	en
dc.contributor.author	Seytre, G	en
dc.contributor.author	Wheatley, R	en
dc.contributor.author	Hakme, C	en
dc.date.accessioned	2014-03-01T01:58:48Z
dc.date.available	2014-03-01T01:58:48Z
dc.date.issued	2009	en
dc.identifier.issn	07540876	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/28734
dc.relation.uri	http://www.scopus.com/inward/record.url?eid=2-s2.0-67549113846&partnerID=40&md5=e5e791b70dfd8f92180023a94847d126	en
dc.title	Process controL through dieLectric monitoring	en
heal.type	journalArticle	en
heal.publicationDate	2009	en
heal.abstract	Researchers have successfully developed the DYNAMIC system that comprises of a sensor, a software program with algorithms, which interpret the sensors, and a process control hardware/interface for improving composite processing. Any thermoset or reactive thermoplast processing that involves mold filing, polymerization, and crystallization steps can use DYNAMIC sensors. The DYNAMIC sensor is the latest in capacitive inter digital sensors developed as part of UK government and European funded projects. The project has advanced INASCO's process monitoring system which carefully selects robust industrial hardware modules for monitoring the electrical properties during the process. The DYNAMIC sensor can detect melting of oligomers, and the arrival of liquid pre-polymer flow fronts. The developed system is capable of examining up to four dielectric sensors and fourteen thermocouples. This system can be used for quality control as it generates alarm signal to process supervisors when processes material fall outside the desired properties.	en
heal.journalName	JEC Composites Magazine	en
dc.identifier.volume	46	en
dc.identifier.issue	48	en
dc.identifier.spage	69	en
dc.identifier.epage	71	en