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Characterization of a commercial 65 nm CMOS technology for SLHC applications

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dc.contributor.author Bonacini, S en
dc.contributor.author Valerio, P en
dc.contributor.author Avramidou, R en
dc.contributor.author Ballabriga, R en
dc.contributor.author Faccio, F en
dc.contributor.author Kloukinas, K en
dc.contributor.author Marchioro, A en
dc.date.accessioned 2014-03-01T02:08:22Z
dc.date.available 2014-03-01T02:08:22Z
dc.date.issued 2012 en
dc.identifier.issn 17480221 en
dc.identifier.uri https://dspace.lib.ntua.gr/xmlui/handle/123456789/29646
dc.subject Digital electronic circuits en
dc.subject Front-end electronics for detector readout en
dc.subject Radiation damage to electronic components en
dc.subject Radiation-hard electronics en
dc.title Characterization of a commercial 65 nm CMOS technology for SLHC applications en
heal.type journalArticle en
heal.identifier.primary 10.1088/1748-0221/7/01/P01015 en
heal.identifier.secondary http://dx.doi.org/10.1088/1748-0221/7/01/P01015 en
heal.identifier.secondary P01015 en
heal.publicationDate 2012 en
heal.abstract The radiation characteristics with respect to Total Ionizing Dose (TID) and Single-Event Upsets (SEUs) of a 65 nm CMOS technology have been investigated. Single transistor structures of a variety of dimensions and several basic circuits were designed and fabricated. The circuits include a 64-kbit shift-register, a 56-kbit SRAM and a ring-oscillator. The test chips were irradiated up to 200 Mrad with an X-ray beam and the corresponding transistor threshold shifts and leakage currents were measured. Heavy-ion beam irradiation was performed to assess the SEU sensitivity of the digital parts. Overall, our results give the confidence that the chosen 65 nm CMOS technology can be used in future High Energy Physics (HEP) experiments even without Hardness-By-Design (HBD) solutions, provided that constant monitoring of the TID response is carried out during the full manufacturing phase of the circuits. © 2012 CERN. en
heal.journalName Journal of Instrumentation en
dc.identifier.doi 10.1088/1748-0221/7/01/P01015 en
dc.identifier.volume 7 en
dc.identifier.issue 1 en


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