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Growth, structural and mechanical characterization and reliability of chemical vapor deposited Co and Co3O4 thin films as candidate materials for sensing applications

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dc.contributor.author Tsikourkitoudi, VP en
dc.contributor.author Koumoulos, EP en
dc.contributor.author Papadopoulos, N en
dc.contributor.author Hristoforou, E en
dc.contributor.author Charitidis, CA en
dc.date.accessioned 2014-03-01T02:09:16Z
dc.date.available 2014-03-01T02:09:16Z
dc.date.issued 2012 en
dc.identifier.issn 14544164 en
dc.identifier.uri https://dspace.lib.ntua.gr/xmlui/handle/123456789/29790
dc.relation.uri http://www.scopus.com/inward/record.url?eid=2-s2.0-84860428774&partnerID=40&md5=3e6b5462c25b8492f79ae9e4a1f941a3 en
dc.subject Chemical vapor deposition en
dc.subject Co thin films en
dc.subject Co3O4 thin films en
dc.subject Nanoindentation en
dc.subject Nanomechanical properties en
dc.title Growth, structural and mechanical characterization and reliability of chemical vapor deposited Co and Co3O4 thin films as candidate materials for sensing applications en
heal.type journalArticle en
heal.publicationDate 2012 en
heal.abstract The adhesion and mechanical stability of thin film coatings on substrates is increasingly becoming a key issue in device reliability as magnetic and storage technology driven products demand smaller, thinner and more complex functional coatings. In the present study, chemical vapor deposited Co and Co3O4 thin films on SiO2 and Si substrates are produced, respectively. Chemical vapor deposition is the most widely used deposition technique which produces thin films well adherent to the substrate. Co and Co3O4 thin films can be used in innovative applications such as magnetic sensors, data storage devices and protective layers. The surface topography of the produced thin films is investigated with Atomic Force Microscopy and the mechanical behavior of them is evaluated. The produced thin films are also characterized using nanoindentation technique. Typical load-displacement curves are obtained and the local changes observed are explained. The nanomechanical properties (hardness and elastic modulus) of the thin films are obtained with Oliver & Pharr model. Finally, an evaluation of the reliability of each thin film (wear analysis) is performed using the hardness to elastic modulus ratio in correlation to the ratio of irreversible work to total work for a complete loading-unloading procedure. en
heal.journalName Journal of Optoelectronics and Advanced Materials en
dc.identifier.volume 14 en
dc.identifier.issue 1-2 en
dc.identifier.spage 169 en
dc.identifier.epage 175 en


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