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Numerical simulation of the wire-pinning process in PET film casting: Steady-state results

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dc.contributor.author Christodoulou, K en
dc.contributor.author Hatzikiriakos, SG en
dc.contributor.author Mitsoulis, E en
dc.date.accessioned 2014-03-01T02:11:33Z
dc.date.available 2014-03-01T02:11:33Z
dc.date.issued 2012 en
dc.identifier.issn 00011541 en
dc.identifier.uri https://dspace.lib.ntua.gr/xmlui/handle/123456789/29940
dc.subject Film casting en
dc.subject Film pinning en
dc.subject Finite element model en
dc.subject PET resins en
dc.subject Wetting of die lip en
dc.subject.other Casting process en
dc.subject.other Film casting en
dc.subject.other Finite element models en
dc.subject.other Governing equations en
dc.subject.other Machine directions en
dc.subject.other Melt flow en
dc.subject.other Nonuniform en
dc.subject.other Parameter range en
dc.subject.other PET films en
dc.subject.other Pinning forces en
dc.subject.other Pinning points en
dc.subject.other Static and dynamic en
dc.subject.other Static contact angle en
dc.subject.other Air entrainment en
dc.subject.other Contact angle en
dc.subject.other Polyethylene terephthalates en
dc.subject.other Wetting en
dc.subject.other Wire en
dc.subject.other Dies en
dc.title Numerical simulation of the wire-pinning process in PET film casting: Steady-state results en
heal.type journalArticle en
heal.identifier.primary 10.1002/aic.12734 en
heal.identifier.secondary http://dx.doi.org/10.1002/aic.12734 en
heal.publicationDate 2012 en
heal.abstract Poly(ethylene terephthalate) (PET) film casting involves melt flow through a slot die, across a small span, and onto a fast moving quench drum. In the ""wire-pinning"" casting process, a thin electrified wire close to the line of contact with the drum creates a strong pinning force that delays air entrainment to higher line speeds. Nonuniform wetting of the die lips by the extruded melt is thought to be responsible for the formation of streaks, a defect in the machine direction. A finite element model of the film casting process with wire pinning was developed to assist in understanding what causes significant wetting of the lips and whether this can be avoided by electrostatic pinning. The solution of the governing equations provide the location of the static and dynamic contact lines, thus finding the wetting and pinning points in the process. The simulations investigate the sensitivity of the static wetting line locations on the die lands to the imposed values of static contact angle and die-lip gap. It was found that while the contact angle has a small effect on the extent of die-lip wetting within the parameter ranges examined, there is a considerable chance that the feed slot surfaces can be dewetted. This seems to be the greatest danger for causing streaks rather than excessive wetting of the die lands. © 2011 American Institute of Chemical Engineers. en
heal.journalName AIChE Journal en
dc.identifier.doi 10.1002/aic.12734 en
dc.identifier.volume 58 en
dc.identifier.issue 7 en
dc.identifier.spage 1979 en
dc.identifier.epage 1986 en


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