Superior performance of multilayered fluoropolymer films in low voltage electrowetting

Papageorgiou, DP; Tserepi, A; Boudouvis, AG; Papathanasiou, AG

dc.contributor.author	Papageorgiou, DP	en
dc.contributor.author	Tserepi, A	en
dc.contributor.author	Boudouvis, AG	en
dc.contributor.author	Papathanasiou, AG	en
dc.date.accessioned	2014-03-01T02:14:46Z
dc.date.available	2014-03-01T02:14:46Z
dc.date.issued	2012	en
dc.identifier.issn	00219797	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/30099
dc.subject	Contact angle saturation	en
dc.subject	Electrowetting on dielectric	en
dc.subject	Plasma-deposited fluorocarbon	en
dc.subject.other	Ac voltage	en
dc.subject.other	Applied voltages	en
dc.subject.other	Contact angle saturation	en
dc.subject.other	Electro wetting	en
dc.subject.other	Electro-wetting on dielectrics	en
dc.subject.other	Fluorocarbon films	en
dc.subject.other	Fluoropolymer	en
dc.subject.other	Fluoropolymer films	en
dc.subject.other	High resistance	en
dc.subject.other	Leakage current measurements	en
dc.subject.other	Low voltages	en
dc.subject.other	Material degradation	en
dc.subject.other	Material failures	en
dc.subject.other	Multi-layered	en
dc.subject.other	Operational voltage	en
dc.subject.other	Top coating	en
dc.subject.other	Chemical vapor deposition	en
dc.subject.other	Composite coatings	en
dc.subject.other	Contact angle	en
dc.subject.other	Dielectric materials	en
dc.subject.other	Dielectric properties of solids	en
dc.subject.other	Electric breakdown	en
dc.subject.other	Impact resistance	en
dc.subject.other	Leakage currents	en
dc.subject.other	Plasma deposition	en
dc.subject.other	Plasma enhanced chemical vapor deposition	en
dc.subject.other	Polytetrafluoroethylenes	en
dc.subject.other	Wetting	en
dc.subject.other	fluorocarbon	en
dc.subject.other	fluoropolymer	en
dc.subject.other	poly(methyl methacrylate)	en
dc.subject.other	polymer	en
dc.subject.other	unclassified drug	en
dc.subject.other	analytic method	en
dc.subject.other	article	en
dc.subject.other	biodegradation	en
dc.subject.other	chemical analysis	en
dc.subject.other	electric potential	en
dc.subject.other	electrolysis	en
dc.subject.other	film	en
dc.subject.other	hydrophobicity	en
dc.subject.other	inhibition kinetics	en
dc.subject.other	measurement	en
dc.subject.other	microtechnology	en
dc.subject.other	plasma enhanced chemical vapor deposition	en
dc.subject.other	priority journal	en
dc.subject.other	reliability	en
dc.subject.other	thickness	en
dc.subject.other	wettability	en
dc.title	Superior performance of multilayered fluoropolymer films in low voltage electrowetting	en
heal.type	journalArticle	en
heal.identifier.primary	10.1016/j.jcis.2011.10.035	en
heal.identifier.secondary	http://dx.doi.org/10.1016/j.jcis.2011.10.035	en
heal.publicationDate	2012	en
heal.abstract	The requirement for low operational voltage in electrowetting devices, met using thin dielectrics, is usually connected with serious material failure issues. Dielectric breakdown (visible as electrolysis) is frequently evident slightly beyond the onset of the contact angle saturation. Here, plasma-enhanced chemical vapor deposition (PECVD) is used to deposit thin fluorocarbon films prior to the spin-coating of Teflon® amorphous fluoropolymer. The resulting multilayered hydrophobic top coating improves the electrowetting performance of the stack, by showing high resistance to dielectric breakdown at high applied voltages and for continuous long term application of DC and AC voltage. Leakage current measurements during electrowetting experiments with the proposed composite coating showed that current remains fairly constant at consecutive electrowetting tests in contrast to plain Teflon® coating in which material degradation is evident by a progressive increase in the leakage current after multiple electrowetting tests. Since the proposed composite coating demonstrates increased resistance to material failure and to dielectric breakdown even at thin configurations, its integration in electrowetting devices may impact their reliability, robustness, and lifetime. © 2011 Elsevier Inc.	en
heal.journalName	Journal of Colloid and Interface Science	en
dc.identifier.doi	10.1016/j.jcis.2011.10.035	en
dc.identifier.volume	368	en
dc.identifier.issue	1	en
dc.identifier.spage	592	en
dc.identifier.epage	598	en