The BOOM project: Towards 160 Gb/s packet switching using soi photonic integrated circuits and hybrid integrated optical flip-flops

Stamatiadis, C; Gomez-Agis, F; Stampoulidis, L; Vyrsokinos, K; Lazarou, I; Dorren, HJS; Zimmermann, L; Voigt, K; Van Thourhout, D; De Heyn, P; Avramopoulos, H

dc.contributor.author	Stamatiadis, C	en
dc.contributor.author	Gomez-Agis, F	en
dc.contributor.author	Stampoulidis, L	en
dc.contributor.author	Vyrsokinos, K	en
dc.contributor.author	Lazarou, I	en
dc.contributor.author	Dorren, HJS	en
dc.contributor.author	Zimmermann, L	en
dc.contributor.author	Voigt, K	en
dc.contributor.author	Van Thourhout, D	en
dc.contributor.author	De Heyn, P	en
dc.contributor.author	Avramopoulos, H	en
dc.date.accessioned	2014-03-01T02:14:48Z
dc.date.available	2014-03-01T02:14:48Z
dc.date.issued	2012	en
dc.identifier.issn	07338724	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/30121
dc.subject	All-optical signal processing	en
dc.subject	all-optical wavelength converter (AOWC)	en
dc.subject	all-optical wavelength routing	en
dc.subject	hybrid photonic integration	en
dc.subject	microring resonator	en
dc.subject	optical flip-flop	en
dc.subject	optical packet switching	en
dc.subject	silicon-on-insulator (SOI)	en
dc.subject.other	All-optical	en
dc.subject.other	All-optical signal processing	en
dc.subject.other	all-optical wavelength converter (AOWC)	en
dc.subject.other	hybrid photonic integration	en
dc.subject.other	Microring resonator	en
dc.subject.other	Optical flip-flop	en
dc.subject.other	Optical packet switching	en
dc.subject.other	Silicon-on-insulators	en
dc.subject.other	Flip flop circuits	en
dc.subject.other	Integration	en
dc.subject.other	Nanowires	en
dc.subject.other	Optical frequency conversion	en
dc.subject.other	Optical resonators	en
dc.subject.other	Optical signal processing	en
dc.subject.other	Optical switches	en
dc.subject.other	Packet switching	en
dc.subject.other	Routers	en
dc.subject.other	Switching	en
dc.subject.other	Waveguides	en
dc.subject.other	Photonic integration technology	en
dc.title	The BOOM project: Towards 160 Gb/s packet switching using soi photonic integrated circuits and hybrid integrated optical flip-flops	en
heal.type	journalArticle	en
heal.identifier.primary	10.1109/JLT.2011.2175901	en
heal.identifier.secondary	http://dx.doi.org/10.1109/JLT.2011.2175901	en
heal.identifier.secondary	6078384	en
heal.publicationDate	2012	en
heal.abstract	We present a 160 Gb/s optical packet switching architecture that performs label detection and packet wavelength conversion using photonic components integrated on silicon-on-insulator (SOI) waveguide boards. For label detection, we report the fabrication of a 4-channel tunable, second-order microring resonator demultiplexer using the SOI nanowire waveguide platform. For all-optical wavelength conversion we report the integration and packaging of a cascaded SOI delay interferometer (DI) structure using SOI rib waveguides. Both components were assembled with an optical flip-flop to enable 160 Gb/s optical packet switching. The power penalty after the wavelength conversion process was ∼4.5 dB with error performance well above the FEC limit. This work is part of the European ICT-BOOM project which aims at building a Tb/s photonic router using hybrid and heterogeneous integration on SOI substrates. The preliminary results reported here is the initial step before the final project demonstrator. © 2011 IEEE.	en
heal.journalName	Journal of Lightwave Technology	en
dc.identifier.doi	10.1109/JLT.2011.2175901	en
dc.identifier.volume	30	en
dc.identifier.issue	1	en
dc.identifier.spage	22	en
dc.identifier.epage	30	en