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Free electron energy during the aging of an organic dielectric under switching impulse voltages

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dc.contributor.author Karagiannopoulos, CG en
dc.contributor.author Bourkas, PD en
dc.contributor.author Agoris, DP en
dc.contributor.author Psomopoulos, CS en
dc.date.accessioned 2014-03-01T02:41:32Z
dc.date.available 2014-03-01T02:41:32Z
dc.date.issued 1998 en
dc.identifier.issn 01642006 en
dc.identifier.uri https://dspace.lib.ntua.gr/xmlui/handle/123456789/30520
dc.subject Electric Field en
dc.subject Environmental Temperature en
dc.subject Impact Ionization en
dc.subject Partial Discharge en
dc.subject.other Aging of materials en
dc.subject.other Electric field effects en
dc.subject.other Electric potential en
dc.subject.other Electrons en
dc.subject.other Free energy en
dc.subject.other Partial discharges en
dc.subject.other Switching impulse voltages en
dc.subject.other Dielectric materials en
dc.title Free electron energy during the aging of an organic dielectric under switching impulse voltages en
heal.type conferenceItem en
heal.identifier.primary 10.1109/ELINSL.1998.694842 en
heal.identifier.secondary http://dx.doi.org/10.1109/ELINSL.1998.694842 en
heal.publicationDate 1998 en
heal.abstract In this work, an experimental approach of the electronic phenomena during the ageing of a metal-dielectric-metal model is performed, under the application of high impulse voltages of the form 250/2500 μs. The outbreak of partial discharges at the above system may come as the result of impact ionization effect, and plays a very important role in the dielectric ageing procedure. The experimental results show an exponential increase of the free electron energy with the applied electric field, as a direct implication of the electrons avalanche mechanism. The above energy involved with the partial discharges depends on the environment temperature (partial discharges enhanced by temperature). en
heal.publisher IEEE, Piscataway, NJ, United States en
heal.journalName Conference Record of IEEE International Symposium on Electrical Insulation en
dc.identifier.doi 10.1109/ELINSL.1998.694842 en
dc.identifier.volume 2 en
dc.identifier.spage 499 en
dc.identifier.epage 502 en


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