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Epitaxial ErSi2-x on strained and relaxed Si1-xGex

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dc.contributor.author Travlos, A en
dc.contributor.author Apostolopoulos, G en
dc.contributor.author Boukos, N en
dc.contributor.author Katiniotis, Ch en
dc.contributor.author Tsamakis, D en
dc.date.accessioned 2014-03-01T02:42:07Z
dc.date.available 2014-03-01T02:42:07Z
dc.date.issued 2002 en
dc.identifier.issn 0921-5107 en
dc.identifier.uri https://dspace.lib.ntua.gr/xmlui/handle/123456789/30791
dc.subject Epitaxy en
dc.subject Erbium silicide en
dc.subject Silicon germanium en
dc.subject.classification Materials Science, Multidisciplinary en
dc.subject.classification Physics, Condensed Matter en
dc.subject.other Crystal lattices en
dc.subject.other Epitaxial growth en
dc.subject.other High temperature effects en
dc.subject.other Semiconducting silicon compounds en
dc.subject.other Substrates en
dc.subject.other Erbium silicides en
dc.subject.other Erbium compounds en
dc.title Epitaxial ErSi2-x on strained and relaxed Si1-xGex en
heal.type conferenceItem en
heal.identifier.primary 10.1016/S0921-5107(01)00835-2 en
heal.identifier.secondary http://dx.doi.org/10.1016/S0921-5107(01)00835-2 en
heal.language English en
heal.publicationDate 2002 en
heal.abstract We study for the first time the epitaxial growth of ErSi2-x on strained and relaxed Si1-xGex substrates, as well as its structural properties. Epitaxy of ErSi2-x is achieved at a temperature of 550 degreesC after the reaction of a very thin Er/Si template layer. ErSi2-x grows in the tetragonal phase, which has been previously observed for epitaxial growth on Si at higher temperatures. ErSi2-x layers grown on relaxed Si1-xGex exhibit a higher crystal quality, due to the reduction of the lattice mismatch with increasing Ge content. (C) 2002 Elsevier Science B.V. All rights reserved. en
heal.publisher ELSEVIER SCIENCE SA en
heal.journalName Materials Science and Engineering B: Solid-State Materials for Advanced Technology en
dc.identifier.doi 10.1016/S0921-5107(01)00835-2 en
dc.identifier.isi ISI:000174015300081 en
dc.identifier.volume 89 en
dc.identifier.issue 1-3 en
dc.identifier.spage 382 en
dc.identifier.epage 385 en


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