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Increased plasma etch resistance of thin polymeric and photoresist films

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dc.contributor.author Vourdas, N en
dc.contributor.author Boudouvis, AG en
dc.contributor.author Gogolides, E en
dc.date.accessioned 2014-03-01T02:43:23Z
dc.date.available 2014-03-01T02:43:23Z
dc.date.issued 2005 en
dc.identifier.issn 0167-9317 en
dc.identifier.uri https://dspace.lib.ntua.gr/xmlui/handle/123456789/31371
dc.subject Glass transition temperature en
dc.subject Plasma etching en
dc.subject Polymers en
dc.subject Thin films en
dc.subject.classification Engineering, Electrical & Electronic en
dc.subject.classification Nanoscience & Nanotechnology en
dc.subject.classification Optics en
dc.subject.classification Physics, Applied en
dc.subject.other Ellipsometry en
dc.subject.other Glass transition en
dc.subject.other Photoresistors en
dc.subject.other Plasma etching en
dc.subject.other Polymers en
dc.subject.other Substrates en
dc.subject.other Temperature distribution en
dc.subject.other Commercial photoresist en
dc.subject.other Increased plasma etch en
dc.subject.other Photoresist films en
dc.subject.other Thin polymeric films en
dc.subject.other Thin films en
dc.title Increased plasma etch resistance of thin polymeric and photoresist films en
heal.type conferenceItem en
heal.identifier.primary 10.1016/j.mee.2004.12.060 en
heal.identifier.secondary http://dx.doi.org/10.1016/j.mee.2004.12.060 en
heal.language English en
heal.publicationDate 2005 en
heal.abstract Plasma etch rate measurements of thin polymeric films are presented. Four commonly used polymers were etched (1) poly-methyl-methacrylate (PMMA), (2) poly-hydroxyethyl-methaerylate (PHEMA), (3) poly-hydroxystyrene (PHS), and (4) a commercial photoresist (GKRS). Their etch rates (ER) in a plasma reactor and their glass transition temperature (T.), were both studied as functions of the initial film thickness. The results clearly show a strong relation between the ER and the initial polymer thickness. The etch rate is decreasing as the initial polymer thickness is decreasing for films thinner than similar to 200 nm. By correlating the plasma ER rate with the T, of the polymeric films, a clear inverse relation is revealed, namely that the ER decreases when the T increases. (c) 2005 Elsevier B.V. All rights reserved. en
heal.publisher ELSEVIER SCIENCE BV en
heal.journalName Microelectronic Engineering en
dc.identifier.doi 10.1016/j.mee.2004.12.060 en
dc.identifier.isi ISI:000228589700078 en
dc.identifier.volume 78-79 en
dc.identifier.issue 1-4 en
dc.identifier.spage 474 en
dc.identifier.epage 478 en


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