Low - K polyimide/silica nanocomposites for microelectronics applications

Logakis, E; Fragiadakis, D; Pissis, P

dc.contributor.author	Logakis, E	en
dc.contributor.author	Fragiadakis, D	en
dc.contributor.author	Pissis, P	en
dc.date.accessioned	2014-03-01T02:44:05Z
dc.date.available	2014-03-01T02:44:05Z
dc.date.issued	2006	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/31667
dc.subject	Dielectric Permittivity	en
dc.subject	Dielectric Relaxation	en
dc.subject	Frequency Dependence	en
dc.subject	Silica	en
dc.subject	Temperature Dependence	en
dc.subject	Water Content	en
dc.subject.other	Broadband dielectric relaxation spectroscopy	en
dc.subject.other	Crosslinked	en
dc.subject.other	Dielectric permittivities	en
dc.subject.other	Frequency dependence	en
dc.subject.other	In-situ	en
dc.subject.other	Inner structure	en
dc.subject.other	Low-k materials	en
dc.subject.other	Organosilicon nanophase	en
dc.subject.other	Polymer dynamics	en
dc.subject.other	Sol-gel technique	en
dc.subject.other	Temperature dependence	en
dc.subject.other	Vapor Phase	en
dc.subject.other	Water sorption	en
dc.subject.other	Gels	en
dc.subject.other	Microelectronics	en
dc.subject.other	Nanocomposites	en
dc.subject.other	Permittivity	en
dc.subject.other	Sorption	en
dc.subject.other	Spectroscopy	en
dc.subject.other	Water vapor	en
dc.subject.other	Polyimides	en
dc.title	Low - K polyimide/silica nanocomposites for microelectronics applications	en
heal.type	conferenceItem	en
heal.identifier.primary	10.1109/ICMEL.2006.1650908	en
heal.identifier.secondary	http://dx.doi.org/10.1109/ICMEL.2006.1650908	en
heal.identifier.secondary	1650908	en
heal.publicationDate	2006	en
heal.abstract	The temperature and frequency dependence of dielectric permittivity of hybrid polyimide/silica nanocomposites, prepared by the in situ generation of crosslinked organosilicon nanophase by sol-gel techniques, was investigated by broadband dielectric relaxation spectroscopy. Dielectric permittivity decreases and its frequency and temperature dependence becomes weaker in the hybrids as compared to pure polyimide. The results are explained in terms of loose inner structure of the spatial aggregates of the organosilicon nanophase and reduced polymer dynamics in the hybrids. Water sorption measurements from the vapor phase show reduced water contents of the nanocomposites with respect to pure polyimide. These results suggest that the hybrids under investigation may have a reasonably good potential as low-k materials for microelectronics applications. © 2006 IEEE.	en
heal.journalName	2006 25th International Conference on Microelectronics, MIEL 2006 - Proceedings	en
dc.identifier.doi	10.1109/ICMEL.2006.1650908	en
dc.identifier.spage	119	en
dc.identifier.epage	122	en