dc.contributor.author |
Moschou, DC |
en |
dc.contributor.author |
Verrelli, E |
en |
dc.contributor.author |
Kouvatsos, DN |
en |
dc.contributor.author |
Normand, P |
en |
dc.contributor.author |
Tsoukalas, D |
en |
dc.contributor.author |
Speliotis, A |
en |
dc.contributor.author |
Bayiati, P |
en |
dc.contributor.author |
Niarchos, D |
en |
dc.date.accessioned |
2014-03-01T02:45:31Z |
|
dc.date.available |
2014-03-01T02:45:31Z |
|
dc.date.issued |
2008 |
en |
dc.identifier.issn |
18626351 |
en |
dc.identifier.uri |
https://dspace.lib.ntua.gr/xmlui/handle/123456789/32291 |
|
dc.subject.other |
Gate electrodes |
en |
dc.subject.other |
Gate insulators |
en |
dc.subject.other |
Gate materials |
en |
dc.subject.other |
Low temperatures |
en |
dc.subject.other |
Optimum performances |
en |
dc.subject.other |
Top gates |
en |
dc.subject.other |
Variations of |
en |
dc.subject.other |
Capacitance |
en |
dc.subject.other |
Capacitors |
en |
dc.subject.other |
Chemical vapor deposition |
en |
dc.subject.other |
Dielectric devices |
en |
dc.subject.other |
Electric equipment |
en |
dc.subject.other |
Electrolysis |
en |
dc.subject.other |
Electrolytic capacitors |
en |
dc.subject.other |
Gate dielectrics |
en |
dc.subject.other |
Gates (transistor) |
en |
dc.subject.other |
Hafnium compounds |
en |
dc.subject.other |
Ion bombardment |
en |
dc.subject.other |
Ion implantation |
en |
dc.subject.other |
Nanoelectronics |
en |
dc.subject.other |
Nanotechnology |
en |
dc.subject.other |
Polysilicon |
en |
dc.subject.other |
Refractory metal compounds |
en |
dc.subject.other |
Voltage measurement |
en |
dc.subject.other |
MOS capacitors |
en |
dc.title |
Investigation of top gate electrode options for high-k gate dielectric MOS capacitors |
en |
heal.type |
conferenceItem |
en |
heal.identifier.primary |
10.1002/pssc.200780147 |
en |
heal.identifier.secondary |
http://dx.doi.org/10.1002/pssc.200780147 |
en |
heal.publicationDate |
2008 |
en |
heal.abstract |
Capacitors with a high-k HfO2 film as gate dielectric were fabricated, using three different variations for the top gate electrode. This way it was possible to acquire important information on which kind of gate material should be used in combination with HfO2 as a gate insulator for optimum performance of possible low temperature applications, such as high-k TFTs. The variations of gate electrode were e-gun evaporated Al, sputtered W and CVD polysilicon followed by ion implantation and annealing. The capacitors were then characterized with capacitance-voltage measurements and current-voltage measurements. © 2008 WILEY-VCH Verlag GmbH & Co. KGaA. |
en |
heal.journalName |
Physica Status Solidi (C) Current Topics in Solid State Physics |
en |
dc.identifier.doi |
10.1002/pssc.200780147 |
en |
dc.identifier.volume |
5 |
en |
dc.identifier.issue |
12 |
en |
dc.identifier.spage |
3626 |
en |
dc.identifier.epage |
3629 |
en |