dc.contributor.author |
Tsoukalas, D |
en |
dc.contributor.author |
Kolliopoulou, S |
en |
dc.contributor.author |
Dimitrakis, P |
en |
dc.contributor.author |
Normand, P |
en |
dc.contributor.author |
Petty, MC |
en |
dc.date.accessioned |
2014-03-01T02:45:40Z |
|
dc.date.available |
2014-03-01T02:45:40Z |
|
dc.date.issued |
2008 |
en |
dc.identifier.uri |
https://dspace.lib.ntua.gr/xmlui/handle/123456789/32323 |
|
dc.subject |
Flash memory |
en |
dc.subject |
Nanoparticles |
en |
dc.subject |
Self-assembly |
en |
dc.subject |
Wafer bonding |
en |
dc.subject.other |
Data storage equipment |
en |
dc.subject.other |
Electronic properties |
en |
dc.subject.other |
Flash memory |
en |
dc.subject.other |
Gold deposits |
en |
dc.subject.other |
Materials |
en |
dc.subject.other |
Nanoparticles |
en |
dc.subject.other |
Self assembly |
en |
dc.subject.other |
Semiconducting silicon compounds |
en |
dc.subject.other |
Silicon wafers |
en |
dc.subject.other |
Three dimensional |
en |
dc.subject.other |
Vanadium |
en |
dc.subject.other |
3-D architectures |
en |
dc.subject.other |
Charge storages |
en |
dc.subject.other |
Electrical characteristics |
en |
dc.subject.other |
Functionalization |
en |
dc.subject.other |
Gate oxides |
en |
dc.subject.other |
Gate stack materials |
en |
dc.subject.other |
Gold nanoparticles |
en |
dc.subject.other |
Hybrid silicons |
en |
dc.subject.other |
Langmuir-Blodgett techniques |
en |
dc.subject.other |
Low temperatures |
en |
dc.subject.other |
Memory cells |
en |
dc.subject.other |
Memory devices |
en |
dc.subject.other |
Memory windows |
en |
dc.subject.other |
Mos fets |
en |
dc.subject.other |
Organic insulators |
en |
dc.subject.other |
Organic technologies |
en |
dc.subject.other |
Organic-inorganic |
en |
dc.subject.other |
Program/erase |
en |
dc.subject.other |
Read-only memories |
en |
dc.subject.other |
V grooves |
en |
dc.subject.other |
Voltage pulse |
en |
dc.subject.other |
Wafer bonding |
en |
dc.title |
Nanoparticles for charge storage using hybrid organic inorganic devices |
en |
heal.type |
conferenceItem |
en |
heal.identifier.primary |
10.4028/www.scientific.net/AST.54.451 |
en |
heal.identifier.secondary |
http://dx.doi.org/10.4028/www.scientific.net/AST.54.451 |
en |
heal.publicationDate |
2008 |
en |
heal.abstract |
We present a concept for integration of low temperature fabricated memory devices in a 3-D architecture using a hybrid silicon-organic technology. The realization of electrically erasable read-only memory (EEPROM) like device is based on the fabrication of a V-groove SiGe MOSFET, the functionalization of a gate oxide followed by self-assembly of gold nanoparticles and finally, the deposition of an organic insulator by Langmuir-Blodgett (LB) technique. Such structures were processed at a temperature lower than 400°C following a process based on wafer bonding. The electrical characteristics of the final hybrid MISFET memory cells were evaluated in terms of memory window and program/erase voltage pulses. A model describing the memory characteristics, based on the electronic properties of the gate stack materials, is presented. © 2008 Trans Tech Publications, Switzerland. |
en |
heal.journalName |
CIMTEC 2008 - Proceedings of the 3rd International Conference on Smart Materials, Structures and Systems - Smart Materials and Micro/Nanosystems |
en |
dc.identifier.doi |
10.4028/www.scientific.net/AST.54.451 |
en |
dc.identifier.volume |
54 |
en |
dc.identifier.spage |
451 |
en |
dc.identifier.epage |
457 |
en |