Agile photonic integrated systems-on-chip enabling WDM terabit networks

Kouloumentas, Ch; Bougioukos, M; Spyropoulou, M; Klonidis, D; Giannoulis, G; Kalavrouziotis, D; Maziotis, A; Gkroumas, P; Apostolopoulos, D; Bakopoulos, P; Poustie, A; Maxwell, G; Velthaus, KO; Kaiser, R; Moerl, L; Tomkos, I; Avramopoulos, H

dc.contributor.author	Kouloumentas, Ch	en
dc.contributor.author	Bougioukos, M	en
dc.contributor.author	Spyropoulou, M	en
dc.contributor.author	Klonidis, D	en
dc.contributor.author	Giannoulis, G	en
dc.contributor.author	Kalavrouziotis, D	en
dc.contributor.author	Maziotis, A	en
dc.contributor.author	Gkroumas, P	en
dc.contributor.author	Apostolopoulos, D	en
dc.contributor.author	Bakopoulos, P	en
dc.contributor.author	Poustie, A	en
dc.contributor.author	Maxwell, G	en
dc.contributor.author	Velthaus, KO	en
dc.contributor.author	Kaiser, R	en
dc.contributor.author	Moerl, L	en
dc.contributor.author	Tomkos, I	en
dc.contributor.author	Avramopoulos, H	en
dc.date.accessioned	2014-03-01T02:47:16Z
dc.date.available	2014-03-01T02:47:16Z
dc.date.issued	2011	en
dc.identifier.issn	21627339	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/33048
dc.subject	advanced modulation formats	en
dc.subject	hybrid integration	en
dc.subject	Monolithic arrays	en
dc.subject	optical regeneration	en
dc.subject.other	Advanced modulation formats	en
dc.subject.other	Cost-efficiency	en
dc.subject.other	Data signals	en
dc.subject.other	Device-scaling	en
dc.subject.other	High capacity	en
dc.subject.other	High yield	en
dc.subject.other	Hybrid integration	en
dc.subject.other	InP	en
dc.subject.other	Integrated arrays	en
dc.subject.other	Integration approach	en
dc.subject.other	Low-power consumption	en
dc.subject.other	Modulated signal	en
dc.subject.other	Monolithic arrays	en
dc.subject.other	Monolithic chip	en
dc.subject.other	Multi-level	en
dc.subject.other	Multifunctionality	en
dc.subject.other	On-chip capacity	en
dc.subject.other	Optical regeneration	en
dc.subject.other	Roadmap	en
dc.subject.other	Silica-on-silicon	en
dc.subject.other	System levels	en
dc.subject.other	Systems on chips	en
dc.subject.other	Terabit	en
dc.subject.other	WDM optical networks	en
dc.subject.other	Fiber optic networks	en
dc.subject.other	Microprocessor chips	en
dc.subject.other	Silica	en
dc.subject.other	Transparent optical networks	en
dc.subject.other	Agile manufacturing systems	en
dc.title	Agile photonic integrated systems-on-chip enabling WDM terabit networks	en
heal.type	conferenceItem	en
heal.identifier.primary	10.1109/ICTON.2011.5971010	en
heal.identifier.secondary	http://dx.doi.org/10.1109/ICTON.2011.5971010	en
heal.identifier.secondary	5971010	en
heal.publicationDate	2011	en
heal.abstract	The ICT-APACHE research project is focusing on the development of cost-effective, compact, scalable and agile integrated components capable of generating, regenerating and receiving multi-level encoded data signals for high capacity (>100 Gb/s) WDM optical networks. APACHE technology relies on InP active, monolithic chips, hybridly integrated on silica-on-silicon planar lightwave platforms in order to achieve cost-efficiency, high yield, low power consumption and device scaling beyond the level commercially available today. The APACHE integration approach is implemented in a two-dimensional plan, horizontally and vertically, in order to enable multi-functionality and increased capacity, respectively. The final goal of the APACHE project is the fabrication of integrated arrays of transmitters, receivers and regenerators that will operate with 100 Gb/s OOK, DPSK and DQPSK modulated signals, allowing for 1 Terabit/s on-chip capacity. In this paper, we will review the latest results from the system-level characterization of the developed components and will outline the roadmap for future endeavours. © 2011 IEEE.	en
heal.journalName	International Conference on Transparent Optical Networks	en
dc.identifier.doi	10.1109/ICTON.2011.5971010	en