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CAD tools for designing 3D integrated systems

Αποθετήριο DSpace/Manakin

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dc.contributor.author Siozios, K en
dc.contributor.author Papanikolaou, A en
dc.contributor.author Soudris, D en
dc.date.accessioned 2014-03-01T02:47:18Z
dc.date.available 2014-03-01T02:47:18Z
dc.date.issued 2011 en
dc.identifier.issn 02714310 en
dc.identifier.uri https://dspace.lib.ntua.gr/xmlui/handle/123456789/33062
dc.subject 3d integration en
dc.subject Consumer Demand en
dc.subject Consumer Electronics en
dc.subject Field Programmable Gate Array en
dc.subject Form Factor en
dc.subject Functional Integration en
dc.subject High Performance en
dc.subject Integrated Circuit en
dc.subject Integrated Circuit Interconnections en
dc.subject Ip Networks en
dc.subject Non Volatile Memory en
dc.subject Personal Computer en
dc.subject Power Consumption en
dc.subject Process Integration en
dc.subject Smart Phone en
dc.subject Solid Modeling en
dc.subject Technology Scaling en
dc.subject Three Dimensional en
dc.subject User Experience en
dc.subject Through Silicon Via en
dc.subject.other 3d systems en
dc.subject.other CAD tool en
dc.subject.other Consumer electronics products en
dc.subject.other Conventional design en
dc.subject.other Form factors en
dc.subject.other Integrated systems en
dc.subject.other Lower-power consumption en
dc.subject.other Manufacturing process en
dc.subject.other Semiconductor technology en
dc.subject.other Three dimensional chip stacking en
dc.subject.other Approximation theory en
dc.subject.other Consumer electronics en
dc.subject.other Semiconductor device manufacture en
dc.subject.other Three dimensional en
dc.subject.other Computer aided design en
dc.title CAD tools for designing 3D integrated systems en
heal.type conferenceItem en
heal.identifier.primary 10.1109/ISCAS.2011.5938044 en
heal.identifier.secondary http://dx.doi.org/10.1109/ISCAS.2011.5938044 en
heal.identifier.secondary 5938044 en
heal.publicationDate 2011 en
heal.abstract Expectations of consumer for future consumer electronics devices put significant strain on conventional design and manufacturing processes. Integrating more functionality in a smaller form factor with lower power consumption and cost is pushing traditional semiconductor technology scaling to its limits. Three dimensional chip stacking is touted as the silver bullet technology that can keep Moore's momentum and fuel the next wave of consumer electronics products. This paper outlines a generic methodology to design 3D systems. © 2011 IEEE. en
heal.journalName Proceedings - IEEE International Symposium on Circuits and Systems en
dc.identifier.doi 10.1109/ISCAS.2011.5938044 en
dc.identifier.spage 2229 en
dc.identifier.epage 2232 en


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