CAD tools for designing 3D integrated systems

Siozios, K; Papanikolaou, A; Soudris, D

dc.contributor.author	Siozios, K	en
dc.contributor.author	Papanikolaou, A	en
dc.contributor.author	Soudris, D	en
dc.date.accessioned	2014-03-01T02:47:18Z
dc.date.available	2014-03-01T02:47:18Z
dc.date.issued	2011	en
dc.identifier.issn	02714310	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/33062
dc.subject	3d integration	en
dc.subject	Consumer Demand	en
dc.subject	Consumer Electronics	en
dc.subject	Field Programmable Gate Array	en
dc.subject	Form Factor	en
dc.subject	Functional Integration	en
dc.subject	High Performance	en
dc.subject	Integrated Circuit	en
dc.subject	Integrated Circuit Interconnections	en
dc.subject	Ip Networks	en
dc.subject	Non Volatile Memory	en
dc.subject	Personal Computer	en
dc.subject	Power Consumption	en
dc.subject	Process Integration	en
dc.subject	Smart Phone	en
dc.subject	Solid Modeling	en
dc.subject	Technology Scaling	en
dc.subject	Three Dimensional	en
dc.subject	User Experience	en
dc.subject	Through Silicon Via	en
dc.subject.other	3d systems	en
dc.subject.other	CAD tool	en
dc.subject.other	Consumer electronics products	en
dc.subject.other	Conventional design	en
dc.subject.other	Form factors	en
dc.subject.other	Integrated systems	en
dc.subject.other	Lower-power consumption	en
dc.subject.other	Manufacturing process	en
dc.subject.other	Semiconductor technology	en
dc.subject.other	Three dimensional chip stacking	en
dc.subject.other	Approximation theory	en
dc.subject.other	Consumer electronics	en
dc.subject.other	Semiconductor device manufacture	en
dc.subject.other	Three dimensional	en
dc.subject.other	Computer aided design	en
dc.title	CAD tools for designing 3D integrated systems	en
heal.type	conferenceItem	en
heal.identifier.primary	10.1109/ISCAS.2011.5938044	en
heal.identifier.secondary	http://dx.doi.org/10.1109/ISCAS.2011.5938044	en
heal.identifier.secondary	5938044	en
heal.publicationDate	2011	en
heal.abstract	Expectations of consumer for future consumer electronics devices put significant strain on conventional design and manufacturing processes. Integrating more functionality in a smaller form factor with lower power consumption and cost is pushing traditional semiconductor technology scaling to its limits. Three dimensional chip stacking is touted as the silver bullet technology that can keep Moore's momentum and fuel the next wave of consumer electronics products. This paper outlines a generic methodology to design 3D systems. © 2011 IEEE.	en
heal.journalName	Proceedings - IEEE International Symposium on Circuits and Systems	en
dc.identifier.doi	10.1109/ISCAS.2011.5938044	en
dc.identifier.spage	2229	en
dc.identifier.epage	2232	en