The ICT-BOOM project: Photonic routing on a silicon-on-insulator hybrid platform

Stamatiadis, C; Stampoulidis, L; Vyrsokinos, K; Lazarou, I; Zimmermann, L; Voigt, K; Moerl, L; Kreissl, J; Sedighi, B; Sheng, Z; De Heyn, P; Van Thourhout, D; Karl, M; Wahlbrink, T; Bolten, J; Leinse, A; Heidemann, R; Gomez-Agis, F; Dorren, HJS; Pagano, A; Riccardi, E; Avramopoulos, H

dc.contributor.author	Stamatiadis, C	en
dc.contributor.author	Stampoulidis, L	en
dc.contributor.author	Vyrsokinos, K	en
dc.contributor.author	Lazarou, I	en
dc.contributor.author	Zimmermann, L	en
dc.contributor.author	Voigt, K	en
dc.contributor.author	Moerl, L	en
dc.contributor.author	Kreissl, J	en
dc.contributor.author	Sedighi, B	en
dc.contributor.author	Sheng, Z	en
dc.contributor.author	De Heyn, P	en
dc.contributor.author	Van Thourhout, D	en
dc.contributor.author	Karl, M	en
dc.contributor.author	Wahlbrink, T	en
dc.contributor.author	Bolten, J	en
dc.contributor.author	Leinse, A	en
dc.contributor.author	Heidemann, R	en
dc.contributor.author	Gomez-Agis, F	en
dc.contributor.author	Dorren, HJS	en
dc.contributor.author	Pagano, A	en
dc.contributor.author	Riccardi, E	en
dc.contributor.author	Avramopoulos, H	en
dc.date.accessioned	2014-03-01T02:47:29Z
dc.date.available	2014-03-01T02:47:29Z
dc.date.issued	2011	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/33176
dc.relation.uri	http://www.scopus.com/inward/record.url?eid=2-s2.0-79956073945&partnerID=40&md5=acd3620664fd37fcc957da4e3881177a	en
dc.relation.uri	http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5753413	en
dc.subject	Optical Filters	en
dc.subject	Optical Waveguide	en
dc.subject	Semiconductor Optical Amplifier	en
dc.subject	Silicon On Insulator	en
dc.subject	Silicon Photonics	en
dc.subject.other	All-optical wavelength conversion	en
dc.subject.other	Flip-chip bonding	en
dc.subject.other	High capacity	en
dc.subject.other	Hybrid platform	en
dc.subject.other	Material processing	en
dc.subject.other	Photonic integrations	en
dc.subject.other	Power efficient	en
dc.subject.other	Routing functionality	en
dc.subject.other	Second generation	en
dc.subject.other	Silicon on insulator	en
dc.subject.other	Silicon photonics	en
dc.subject.other	Wafer scale fabrication	en
dc.subject.other	Bonding	en
dc.subject.other	Fiber optic networks	en
dc.subject.other	Flip chip devices	en
dc.subject.other	Photonics	en
dc.subject.other	Semiconducting silicon compounds	en
dc.subject.other	Wafer bonding	en
dc.subject.other	Silicon wafers	en
dc.title	The ICT-BOOM project: Photonic routing on a silicon-on-insulator hybrid platform	en
heal.type	conferenceItem	en
heal.identifier.secondary	5753413	en
heal.publicationDate	2011	en
heal.abstract	BOOM is a photonic integration concept that aims to develop compact, cost-effective and power efficient silicon photonic components for high capacity routing functionalities. To accomplish this, flip-chip bonding and heterogeneous wafer scale fabrication techniques are employed that enable Si manufacturing with III-IV material processing. We present in this paper the second generation of BOOM devices that perform all-optical wavelength conversion, label processing and switching on SOI nano-wire boards. © 2011 IFIP.	en
heal.journalName	ONDM 2011 - 15th Conference on Optical Network Design and Modeling	en