C-MOLD simulations of the mold filling process with special consideration of the gates microgeometry

Bikas, Athanasios; Kaliora, Georgia; Kanarachos, Andreas

dc.contributor.author	Bikas, Athanasios	en
dc.contributor.author	Kaliora, Georgia	en
dc.contributor.author	Kanarachos, Andreas	en
dc.date.accessioned	2014-03-01T02:48:39Z
dc.date.available	2014-03-01T02:48:39Z
dc.date.issued	1998	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/33995
dc.relation.uri	http://www.scopus.com/inward/record.url?eid=2-s2.0-0031701197&partnerID=40&md5=918f93c65655473d6e9aaaceb76971ac	en
dc.subject.other	Anisotropy	en
dc.subject.other	Computer simulation	en
dc.subject.other	Plastic molds	en
dc.subject.other	Plastics	en
dc.subject.other	Shear stress	en
dc.subject.other	C mold simulations	en
dc.subject.other	Gates microgeometry	en
dc.subject.other	Mold filling	en
dc.subject.other	Injection molding	en
dc.title	C-MOLD simulations of the mold filling process with special consideration of the gates microgeometry	en
heal.type	conferenceItem	en
heal.publicationDate	1998	en
heal.abstract	Injection molding is one of the most important and efficient manufacturing techniques for polymeric materials, depending on i) polymeric material-, ii) machine- and iii) processing-technology. As demands for improved product quality and enchanted engineering properties are required for polymeric materials, the injection molding process has become increasingly difficult. These trends have also driven the advancement of computer simulations of the mold filling process. In the present paper results of computer simulations with C-MOLD are presented, analyzing especially the dependence of flow uniformity, uniform filling pattern, shear stresses, shrinkage, warpage and secondary flow of the gate's microgeometry. The above methodology ends with the optimization of the mold design for the production of a tensile stress specimen.	en
heal.publisher	Soc Plast Eng, Brookfield, CT, United States	en
heal.journalName	Annual Technical Conference - ANTEC, Conference Proceedings	en
dc.identifier.volume	3	en
dc.identifier.spage	3522	en
dc.identifier.epage	3526	en