Multiband RF and mm-wave design solutions for integrated RF functions in liquid crystal polymer system-on-package technology

Palazzaril, V; Thompson, D; Papageorgiou, N; Pinel, S; Lee, J; Sarkar, S; Pratap, R; DeJean, G; Bairavasubramanian, R; Li, R; Tentzeris, M; Laskar, J; Papapolymerou, J; Roselli, L

dc.contributor.author	Palazzaril, V	en
dc.contributor.author	Thompson, D	en
dc.contributor.author	Papageorgiou, N	en
dc.contributor.author	Pinel, S	en
dc.contributor.author	Lee, J	en
dc.contributor.author	Sarkar, S	en
dc.contributor.author	Pratap, R	en
dc.contributor.author	DeJean, G	en
dc.contributor.author	Bairavasubramanian, R	en
dc.contributor.author	Li, R	en
dc.contributor.author	Tentzeris, M	en
dc.contributor.author	Laskar, J	en
dc.contributor.author	Papapolymerou, J	en
dc.contributor.author	Roselli, L	en
dc.date.accessioned	2014-03-01T02:49:40Z
dc.date.available	2014-03-01T02:49:40Z
dc.date.issued	2004	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/34675
dc.subject	Liquid Crystal Polymer	en
dc.subject	Millimeter Wave	en
dc.subject	Water Absorption	en
dc.subject	Front End	en
dc.subject	Single Input Single Output	en
dc.subject	System On Package	en
dc.title	Multiband RF and mm-wave design solutions for integrated RF functions in liquid crystal polymer system-on-package technology	en
heal.type	conferenceItem	en
heal.identifier.primary	10.1109/ECTC.2004.1320338	en
heal.identifier.secondary	http://dx.doi.org/10.1109/ECTC.2004.1320338	en
heal.publicationDate	2004	en
heal.abstract	Electronic packaging evolution involves systems, technology and material considerations. In this paper, we present a liquid crystal polymer (LCP) based multilayer packaging technology that is rapidly emerging as an ideal platform for low cost, multi-band and reconfigurable RF front-end module integration. LCP's very low water absorption (0.04%), low cost and high electrical performance makes it very appealing for RF applications.	en
heal.journalName	Electronic Components and Technology Conference	en
dc.identifier.doi	10.1109/ECTC.2004.1320338	en