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RF and mm-wave SOP module platform using LCP and RF MEMS technologies

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dc.contributor.author Sarkar, S en
dc.contributor.author Palazarri, V en
dc.contributor.author Wang, G en
dc.contributor.author Papageorgiou, N en
dc.contributor.author Thompson, D en
dc.contributor.author Lee, J en
dc.contributor.author Pinel, S en
dc.contributor.author Tentzeris, M en
dc.contributor.author Papapolymerou, J en
dc.contributor.author Laskar, J en
dc.date.accessioned 2014-03-01T02:49:41Z
dc.date.available 2014-03-01T02:49:41Z
dc.date.issued 2004 en
dc.identifier.uri https://dspace.lib.ntua.gr/xmlui/handle/123456789/34684
dc.subject Indexing Terms en
dc.subject Liquid Crystal Polymer en
dc.subject reconfigurable system en
dc.subject Rf Mems en
dc.subject Water Absorption en
dc.subject Wireless Communication en
dc.subject Wireless Lan en
dc.subject Front End en
dc.subject Insertion Loss en
dc.subject Single Input Single Output en
dc.subject System On Package en
dc.title RF and mm-wave SOP module platform using LCP and RF MEMS technologies en
heal.type conferenceItem en
heal.identifier.primary 10.1109/MWSYM.2004.1336043 en
heal.identifier.secondary http://dx.doi.org/10.1109/MWSYM.2004.1336043 en
heal.publicationDate 2004 en
heal.abstract In this paper, we present a Liquid Crystal Polymer (LCP) based multilayer packaging technology combined with RF-MEMS technology and its emergence as an ideal platform for low cost, multi-band and reconfigurable RF front-end module integration. LCP's very low water absorption (0.04%), low cost and high electrical performance makes it very appealing for RF applications. Here, we describe the characterization of en
heal.journalName Microwave, MTT-S International Symposium en
dc.identifier.doi 10.1109/MWSYM.2004.1336043 en


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