RF and mm-wave SOP module platform using LCP and RF MEMS technologies

Sarkar, S; Palazarri, V; Wang, G; Papageorgiou, N; Thompson, D; Lee, J; Pinel, S; Tentzeris, M; Papapolymerou, J; Laskar, J

dc.contributor.author	Sarkar, S	en
dc.contributor.author	Palazarri, V	en
dc.contributor.author	Wang, G	en
dc.contributor.author	Papageorgiou, N	en
dc.contributor.author	Thompson, D	en
dc.contributor.author	Lee, J	en
dc.contributor.author	Pinel, S	en
dc.contributor.author	Tentzeris, M	en
dc.contributor.author	Papapolymerou, J	en
dc.contributor.author	Laskar, J	en
dc.date.accessioned	2014-03-01T02:49:41Z
dc.date.available	2014-03-01T02:49:41Z
dc.date.issued	2004	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/34684
dc.subject	Indexing Terms	en
dc.subject	Liquid Crystal Polymer	en
dc.subject	reconfigurable system	en
dc.subject	Rf Mems	en
dc.subject	Water Absorption	en
dc.subject	Wireless Communication	en
dc.subject	Wireless Lan	en
dc.subject	Front End	en
dc.subject	Insertion Loss	en
dc.subject	Single Input Single Output	en
dc.subject	System On Package	en
dc.title	RF and mm-wave SOP module platform using LCP and RF MEMS technologies	en
heal.type	conferenceItem	en
heal.identifier.primary	10.1109/MWSYM.2004.1336043	en
heal.identifier.secondary	http://dx.doi.org/10.1109/MWSYM.2004.1336043	en
heal.publicationDate	2004	en
heal.abstract	In this paper, we present a Liquid Crystal Polymer (LCP) based multilayer packaging technology combined with RF-MEMS technology and its emergence as an ideal platform for low cost, multi-band and reconfigurable RF front-end module integration. LCP's very low water absorption (0.04%), low cost and high electrical performance makes it very appealing for RF applications. Here, we describe the characterization of	en
heal.journalName	Microwave, MTT-S International Symposium	en
dc.identifier.doi	10.1109/MWSYM.2004.1336043	en