Electrochemical and surface analytical studies of silver deposits for industrial electroplating

Anastassakis, G; Sequeira, CAC

dc.contributor.author	Anastassakis, G	en
dc.contributor.author	Sequeira, CAC	en
dc.date.accessioned	2014-03-01T02:51:36Z
dc.date.available	2014-03-01T02:51:36Z
dc.date.issued	2008	en
dc.identifier.issn	02555476	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/35588
dc.relation.uri	http://www.scopus.com/inward/record.url?eid=2-s2.0-60449119963&partnerID=40&md5=40ba7a40ffd586aa9bcf86014bde84e3	en
dc.subject	Electroplating	en
dc.subject	Physicochemical studies	en
dc.subject	Silver electrodeposition	en
dc.subject	Thiosulphate baths	en
dc.subject.other	Complex formations	en
dc.subject.other	Complexing agents	en
dc.subject.other	Electroplating baths	en
dc.subject.other	Environmental problems	en
dc.subject.other	Kinetic characteristics	en
dc.subject.other	Kinetic studies	en
dc.subject.other	Physicochemical studies	en
dc.subject.other	Plating conditions	en
dc.subject.other	Silver cyanides	en
dc.subject.other	Silver electrodeposition	en
dc.subject.other	Thermo-dynamic datum	en
dc.subject.other	Thiosulphate baths	en
dc.subject.other	Toxic properties	en
dc.subject.other	Cyanides	en
dc.subject.other	Electrochemistry	en
dc.subject.other	Electrodeposition	en
dc.subject.other	Electroplating	en
dc.subject.other	Materials	en
dc.subject.other	Self phase modulation	en
dc.subject.other	Silver plating	en
dc.subject.other	Statistical process control	en
dc.subject.other	Silver deposits	en
dc.title	Electrochemical and surface analytical studies of silver deposits for industrial electroplating	en
heal.type	conferenceItem	en
heal.publicationDate	2008	en
heal.abstract	For silver plating, mainly silver cyanide solutions are used and this is extensively treated in the literature. Yet, in view of the growing concern for environmental problems, they will have to be replaced because of their toxic properties. In the present work, the appropriateness of thiosulphate (S 2O32-), a complexing agent for silver of common use in photographic applications, as an alternative for cyanide in electroplating baths is investigated. The kinetic characteristics of the reduction are determined, since they fix at which rate the plating can proceed. Prior to the kinetic study, requiring measurements in solutions of varying composition, the thermodynamic data on complex formation between Ag+ and S2O32- ions are analysed. And finally, the composition and the morphology of the silver deposits are examined as a function of the plating conditions. Electrochemical and analytical physical techniques are used.	en
heal.journalName	Materials Science Forum	en
dc.identifier.volume	587-588	en
dc.identifier.spage	829	en
dc.identifier.epage	833	en