A Temperature-Aware Time-Dependent Dielectric Breakdown Analysis Framework

Bekiaris, D; Papanikolaou, A; Papameletis, C; Soudris, D; Economakos, G; Pekmestzi, K

dc.contributor.author	Bekiaris, D	en
dc.contributor.author	Papanikolaou, A	en
dc.contributor.author	Papameletis, C	en
dc.contributor.author	Soudris, D	en
dc.contributor.author	Economakos, G	en
dc.contributor.author	Pekmestzi, K	en
dc.date.accessioned	2014-03-01T02:52:17Z
dc.date.available	2014-03-01T02:52:17Z
dc.date.issued	2010	en
dc.identifier.uri	https://dspace.lib.ntua.gr/xmlui/handle/123456789/35881
dc.subject	Complex System	en
dc.subject	Critical Path	en
dc.subject	Technology Scaling	en
dc.subject	Time Dependent Dielectric Breakdown	en
dc.title	A Temperature-Aware Time-Dependent Dielectric Breakdown Analysis Framework	en
heal.type	conferenceItem	en
heal.identifier.primary	10.1007/978-3-642-17752-1_8	en
heal.identifier.secondary	http://dx.doi.org/10.1007/978-3-642-17752-1_8	en
heal.publicationDate	2010	en
heal.abstract	The shrinking of interconnect width and thickness, due to technology scaling, along with the integration of low-k dielectrics, reveal novel reliability wear-out mechanisms, progressively affecting the performance of complex systems. These phenomena progressively deteriorate the electrical characteristics and therefore the delay of interconnects, leading to violations in timing-critical paths. This work estimates the timing impact of Time-Dependent Dielectric Breakdown (TDDB)	en
heal.journalName	Workshop on Power and Timing Modeling, Optimization and Simulation	en
dc.identifier.doi	10.1007/978-3-642-17752-1_8	en